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参数资料
| 型号： | HLMP-HM57 |
| 厂商： | Avago Technologies Ltd. |
| 英文描述： | Precision Optical Performance Red, Green and Blue 5 mm Standard Oval LEDs |
| 中文描述： | 精密光学性能红，绿，蓝5毫米标准椭圆形发光二极管 |
| 文件页数： | 9/12页 |
| 文件大小： | 306K |
| 代理商： | HLMP-HM57 |
9
Precautions:
Lead Forming:
TheleadsofanLEDlampmaybepreformedorcutto
lengthpriortoinsertionandsolderingonPCboard.
Forbettercontrol,itisrecommendedtouseproper
tooltopreciselyformandcuttheleadstoapplicable
lengthratherthandoingitmanually.
Ifmanualleadcuttingisnecessary,cuttheleadsafter
thesolderingprocess.Thesolderconnectionforms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package.Thisishighlyrecommendedforhandsolder
operation,astheexcessleadlengthalsoactsassmall
heatsink.
Soldering and Handling:
CaremustbetakenduringPCBassemblyandsoldering
processtopreventdamagetotheLEDcomponent.
LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closestmanualsolderingdistanceofthesoldering
heat source (soldering iron’s tip) to the body is
1.59mm.SolderingtheLEDusingsolderingirontip
closerthan1.59mmmightdamagetheLED.
Note:
1. PCBwithdifferentsizeanddesign(componentdensity)willhave
differentheatmass(heatcapacity).Thismightcauseachangein
temperature experienced by the board if same wave soldering
settingisused.So,itisrecommendedtore-calibratethesoldering
profileagainbeforeloadinganewtypeofPCB.
2. AvagoTechnologies’highbrightnessLEDareusinghighefficiency
LEDdiewithsinglewirebondasshownbelow.Customerisadvised
to take extra precaution during wave soldering to ensure that
themaximumwavetemperaturedoesnotexceed250°Candthe
soldercontacttimedoesnotexceeding3sec.Over-stressingthe
LEDduringsolderingprocessmightcauseprematurefailuretothe
LEDduetodelamination.
Avago Technologies LED configuration
1.59mm
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damagetotheLEDcomponentthatisESDsensitive.
DorefertoAvagoapplicationnoteAN1142fordetails.
Thesolderingironusedshouldhavegroundedtipto
ensureelectrostaticchargeisproperlygrounded.
Recommendedsolderingcondition:
Wave
Soldering
[1, 2]
105 °C Max.
60 sec Max
250 °C Max.
3 sec Max.
Manual Solder
Dipping
-
-
260 °C Max.
5 sec Max
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
Note:
1) Above conditions refers to measurement with thermocouple
mountedatthebottomofPCB.
2) It is recommended to use only bottom preheaters in order to
reducethermalstressexperiencedbyLED.
Wave soldering parameters must be set and
maintained
according
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensurethatitisalwaysconformingtorecommended
solderingconditions.
to
the
recommended
Note:ElectricalconnectionbetweenbottomsurfaceofLEDdieand
theleadframeisachievedthroughconductivepaste.
Anyalignmentfixturethatisbeingappliedduring
wavesolderingshouldbelooselyfittedandshould
notapplyweightorforceonLED.Nonmetalmaterial
isrecommendedasitwillabsorblessheatduring
wavesolderingprocess.
Atelevatedtemperature,LEDismoresusceptibleto
mechanicalstress.Therefore,PCBmustallowedtocool
downtoroomtemperaturepriortohandling,which
includesremovalofalignmentfixtureorpallet.
IfPCBboardcontainsboththroughhole(TH)LEDand
othersurfacemountcomponents,itisrecommended
thatsurfacemountcomponentsbesolderedonthe
topsideofthePCB.Ifsurfacemountneedtobeonthe
bottomside,thesecomponentsshouldbesoldered
usingreflowsolderingpriortoinsertiontheTHLED.
RecommendedPCboardplatedthroughholes(PTH)
sizeforLEDcomponentleads.
LED component
lead size
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
Diagonal
0.636 mm
(0.025 inch)
0.707 mm
(0.028 inch)
Plated through
hole diameter
0.98 to 1.08 mm
(0.039 to 0.043 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
Over-sizing the PTH can lead to twisted LED after
clinching.OntheotherhandundersizingthePTHcan
causedifficultyinsertingtheTHLED.
CATHODE
ANODE
AlInGaP Device
InGaN Device
相关PDF资料 |
PDF描述 |
|---|---|
| HLMP-HM57-RSCxx | Precision Optical Performance Red, Green and Blue 5 mm Standard Oval LEDs |
| HLMP-HM57-RU0xx | Precision Optical Performance Red, Green and Blue 5 mm Standard Oval LEDs |
| HLMP-HM57-SV0xx | Precision Optical Performance Red, Green and Blue 5 mm Standard Oval LEDs |
| HLMP-HB61 | Precision Optical Performance Red, Green and Blue 5mm Standard Oval LEDs |
| HLMP-HB61-QU0ZZ | Precision Optical Performance Red, Green and Blue 5mm Standard Oval LEDs |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HLMP-HM57-RSCZZ | 功能描述:标准LED-通孔 Lamp 5mm InGaN Grn 4 0X100deg RoHS:否 制造商:Vishay Semiconductors 照明颜色:Red 光强度:0.7 mcd 波长/色温:615 nm 显示角:45 deg 透镜颜色/类型:Clear, Non-Diffused 正向电流:70 mA 正向电压:1.83 V to 3.03 V LED 大小:2 mm 系列: 封装:Tube |
| HLMP-HM57-RU0ZZ | 功能描述:标准LED-通孔 Lamp 5mm InGaN Grn 4 0X100deg RoHS:否 制造商:Vishay Semiconductors 照明颜色:Red 光强度:0.7 mcd 波长/色温:615 nm 显示角:45 deg 透镜颜色/类型:Clear, Non-Diffused 正向电流:70 mA 正向电压:1.83 V to 3.03 V LED 大小:2 mm 系列: 封装:Tube |
| HLMP-HM57-SV000 | 功能描述:标准LED-通孔 Green 40x100deg 0X100deg RoHS:否 制造商:Vishay Semiconductors 照明颜色:Red 光强度:0.7 mcd 波长/色温:615 nm 显示角:45 deg 透镜颜色/类型:Clear, Non-Diffused 正向电流:70 mA 正向电压:1.83 V to 3.03 V LED 大小:2 mm 系列: 封装:Tube |
| HLMP-HM57-SV0DD | 功能描述:标准LED-通孔 Lamp 5mm InGaN Grn 4 0X100deg RoHS:否 制造商:Vishay Semiconductors 照明颜色:Red 光强度:0.7 mcd 波长/色温:615 nm 显示角:45 deg 透镜颜色/类型:Clear, Non-Diffused 正向电流:70 mA 正向电压:1.83 V to 3.03 V LED 大小:2 mm 系列: 封装:Tube |
| HLMP-HM57-SV0ZZ | 功能描述:标准LED-通孔 Green 40x100deg 0X100deg RoHS:否 制造商:Vishay Semiconductors 照明颜色:Red 光强度:0.7 mcd 波长/色温:615 nm 显示角:45 deg 透镜颜色/类型:Clear, Non-Diffused 正向电流:70 mA 正向电压:1.83 V to 3.03 V LED 大小:2 mm 系列: 封装:Tube |
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