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参数资料
| 型号： | HLMP-NM31-R00xx |
| 厂商： | Avago Technologies Ltd. |
| 英文描述： | T-1 (3mm) InGaN LED Lamps |
| 中文描述： | 的T 1（3毫米）的InGaN LED灯具 |
| 文件页数： | 5/6页 |
| 文件大小： | 195K |
| 代理商： | HLMP-NM31-R00XX |
5
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attached and wirebond.
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for those
parts without standoffs.
Recommended soldering condition:
Wave Soldering
05 oC Max.
30 sec Max.
50 oC Max.
3 sec Max.
Manual Solder
Dipping
-
-
60 oC Max.
5 sec Max.
Pre-heat temperature
Pre-heat time
Peak temperature
Dwell time
Wave soldering parameter must be set and maintain
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25 oC before handling.
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
Recommended PC board plated through hole size for
LED component leads:
LED component
lead size
0.457 x 0.457 mm
(0.05 inch)
0.508 x 0.508 mm
(0.08 inch)
Diagonal
(0.08 x 0.08 inch)
0.976 to .078 mm
(0.00 x 0.00 inch)
.049 to .50 mm
Plated through
hole diameter
0.646 mm
(0.038 to 0.04 inch)
0.78 mm
(0.04 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
250
200
150
FLUXING
TURBULENT WAVE
PREHEAT
TIME - SECONDS
T
100
50
30
0
10
20
304
0
50
607
0
809
0
100
LAMINAR WAVE
HOT AIR KNIFE
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HLMP-NS30-J0000 | 功能描述:标准LED-通孔 Blue nGaN 470nmBlue RoHS:否 制造商:Vishay Semiconductors 照明颜色:Red 光强度:0.7 mcd 波长/色温:615 nm 显示角:45 deg 透镜颜色/类型:Clear, Non-Diffused 正向电流:70 mA 正向电压:1.83 V to 3.03 V LED 大小:2 mm 系列: 封装:Tube |
| HLMP-NS31-J0000 | 功能描述:标准LED-通孔 Blue nGaN 470nmBlue RoHS:否 制造商:Vishay Semiconductors 照明颜色:Red 光强度:0.7 mcd 波长/色温:615 nm 显示角:45 deg 透镜颜色/类型:Clear, Non-Diffused 正向电流:70 mA 正向电压:1.83 V to 3.03 V LED 大小:2 mm 系列: 封装:Tube |
| HLMP-P005-F0011 | 功能描述:标准LED-SMD Poly FTop Red RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel |
| HLMP-P005-F0031 | 功能描述:标准LED-SMD Poly FTop Red RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel |
| HLMP-P102-F0032 | 功能描述:标准LED-SMD Poly FTop Red RoHS:否 制造商:Vishay Semiconductors 封装 / 箱体:0402 LED 大小:1 mm x 0.5 mm x 0.35 mm 照明颜色:Red 波长/色温:631 nm 透镜颜色/类型:Water Clear 正向电流:30 mA 正向电压:2 V 光强度:54 mcd 显示角:130 deg 系列:VLMx1500 封装:Reel |
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