参数资料
型号: HMC140
厂商: HITTITE MICROWAVE CORP
元件分类: 混频器
英文描述: 1000 MHz - 2000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX
文件页数: 4/4页
文件大小: 74K
代理商: HMC140
4 - 17
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
MICROWAVE CORPORATION
SEPTEMBER 1999
Mixers
4
HMC140 DOUBLE-BALANCED MIXER 1.0 - 2.0 GHz
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22
grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds.
Wirebonds should be started on the chip and terminated on the package. RF bonds should be as short as
possible.
Handling Precautions
Wire Bonding
The chip is not back-metallized and can be die mounted with electrically conductive epoxy only. The
mounting surface should be clean and flat.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around
the perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer's schedule.
Mounting
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid
cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes (
see page 8 - 2 ).
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent twee-
zers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, twee-
zers, or fingers.
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