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参数资料
| 型号： | HMC157 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 倍频器 |
| 英文描述： | RF/MICROWAVE FREQUENCY DOUBLER |
| 封装： | DIE |
| 文件页数： | 4/4页 |
| 文件大小： | 79K |
| 代理商： | HMC157 |
MICROWAVE CORPORATION
FEBRUARY 2001
3 - 13
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
3
M
UL
TIPLIERS
DIE
GaAs MMIC FREQUENCY DOUBLER 1 - 2 GHz INPUT
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22
grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds.
Wirebonds should be started on the chip and terminated on the package. RF bonds should be as short as
possible.
Handling Precautions
Wire Bonding
The chip is not back-metallized and can be die mounted with electrically conductive epoxy. The mounting
surface should be clean and flat.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around
the perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer's schedule.
Mounting
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid
cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes ( see page 8 - 2 ).
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent twee-
zers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, twee-
zers, or fingers.
HMC157
V01.0700
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| HMC157C8 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT FREQUENCY DOUBLER 1 - 2 GHz INPUT |
| HMC158 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT |
| HMC158_11 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC PASSIVE FREQUENCY DOUBLER CHIP, 1.3 - 4.0 GHz INPUT |
| HMC158C8 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT |
| HMC158C8_06 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT |
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