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参数资料
| 型号： | HMC183QS24E |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 开关 |
| 英文描述： | 0 MHz - 2000 MHz RF/MICROWAVE DIVERSITY SWITCH, 1.8 dB INSERTION LOSS |
| 封装： | ROHS COMPLIANT, PLASTIC, SMT, QSOP-24 |
| 文件页数： | 3/4页 |
| 文件大小： | 179K |
| 代理商： | HMC183QS24E |
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10 - 16
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Truth Table
Absolute Maximum Ratings
Outline Drawing
Bias Voltage Range (Port Vee)
-7.0 Vdc
Control Voltage Range (A & B)
Vee -0.5 to +1.0 Vdc
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Maximum Input Power
+26 dBm (<500 MHz)
+29 dBm (>500 MHz)
Control Input
Signal Path State
AB
C
RFCOM to:
High
RF1
Low
High
RF2
High
Low
High
RF3
Low
High
RF4
High
Low
RF5
Low
High
Low
RF6
High
Low
RF7
Low
RF8
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC183QS24 / 183QS24E
GaAs MMIC SP8T NON-REFLECTIVE
SWITCH, DC - 2 GHz
v02.0805
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Part Number
Package Body Material
Leadframe Plating
MSL Rating
Package Marking
[3]
HMC183QS24
Low Stress Injection Molded Plastic Silica
and Silicon Impregnated
Sn/Pb Solder
MSL1
[1]
HMC183
XXXX
HMC183QS24E
RoHS-compliant Low Stress Injection Molded
Plastic Silica and Silicon Impregnated
100% Matte Tin
MSL1
[2]
HMC183
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
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