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参数资料
| 型号： | HMC240A |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 开关 |
| 英文描述： | 0 MHz - 4000 MHz RF/MICROWAVE DIVERSITY SWITCH, 1.4 dB INSERTION LOSS |
| 封装： | 0.66 X 0.60 MM, 0.18 MM HEIGHT, DIE-9 |
| 文件页数： | 6/6页 |
| 文件大小： | 241K |
| 代理商： | HMC240A |
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For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either waffle or Gel based eSD protective containers, and then sealed in an eSD protective
bag for shipment. Once the sealed eSD protective bag has been opened, all die should be stored in a dry nitrogen environment.
Cleanliness: handle the chips in a clean environment. DO NOt attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow eSD precautions to protect against eSD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. the surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean
and flat.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of
150 deg. c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31mm (12 mils).
HMC240A
v00.0211
GaAs MMIC SPDT SWITCH
DC - 4 GHz
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