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参数资料
| 型号： | HMC245QS16ETR |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 开关 |
| 英文描述： | 0 MHz - 3500 MHz RF/MICROWAVE SGL POLE TRIPLE THROW SWITCH, 1 dB INSERTION LOSS |
| 封装： | ROHS COMPLIANT, PLASTIC, SMT, QSOP-16 |
| 文件页数： | 4/6页 |
| 文件大小： | 187K |
| 代理商： | HMC245QS16ETR |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
Absolute Maximum Ratings
Bias Voltage Range (Port Vdd)
+7.0 Vdc
Control Voltage Range (A & B)
-0.5V to Vdd +1 Vdc
Channel Temperature
150 °C
Thermal Resistance
(Insertion Loss Path)
210 °C/W
Thermal Resistance
(Terminated Path)
250 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Maximum Input Power
Vdd = +5 Vdc
+20 dBm (0.05 - 0.5 GHz)
+27 dBm (0.5 - 3.5 GHz)
ESD Sensitivity (HBM)
Class 1A
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC245QS16 / 245QS16E
GaAs MMIC SP3T NON-REFLECTIVE
SWITCH, DC - 3.5 GHz
v02.0805
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Part Number
Package Body Material
Leadframe Plating
MSL Rating
Package Marking
[3]
HMC245QS16
Low Stress Injection Molded Plastic Silica
and Silicon Impregnated
Sn/Pb Solder
MSL1
[1]
HMC245
XXXX
HMC245QS16E
RoHS-compliant Low Stress Injection Molded
Plastic Silica and Silicon Impregnated
100% Matte Tin
MSL1
[2]
HMC245
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
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