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参数资料
| 型号： | HMC247 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 移相器 |
| 英文描述： | 5000 MHz - 18000 MHz, 0 deg - 100 deg RF/MICROWAVE PHASE SHIFTER |
| 封装： | 2.30 X 1.60 MM, 0.10 MM HEIGHT, DIE-5 |
| 文件页数： | 6/6页 |
| 文件大小： | 219K |
| 代理商： | HMC247 |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag
for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize
inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the
chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean
and flat.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum
level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or
substrate. All bonds should be as short as possible <0.31mm (12 mils).
Outline Drawing
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. TIE ALL UNLABLED BOND PADS TO GROUND.
3. DIE THICKNESS IS .004”
4. TYPICAL BOND PAD IS .004” SQUARE.
5. BACKSIDE METALIZATION: GOLD.
6. BOND PAD METALIZATION: GOLD.
HMC247
v03.0809
400° ANALOG PHASE SHIFTER
5 - 18 GHz
Die Packaging Information
[1]
Standard
Alternate
WP-4 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HMC247_08 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:400∑ ANALOG PHASE SHIFTER 5 - 18 GHz |
| HMC247-SX | 功能描述:IC PHASE SHIFTER DIE 制造商:analog devices inc. 系列:- 包装:托盘 零件状态:在售 功能:相移 频率:5GHz ~ 18GHz RF 类型:通用 辅助属性:- 封装/外壳:模具 供应商器件封装:模具 标准包装:2 |
| HMC2512JT20M0 | 制造商:SEI Stackpole Electronics Inc 功能描述:RES THKFLM 2512 20M OHM 5% 1W 200PPM/ C SMD - Tape and Reel |
| HMC251MS8 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT DIVIDE-BY-2, 3.0 - 6.5 GHz |
| HMC251MS8_01 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SMT DIVIDE-BY-2, 3.0 - 6.5 GHz |
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