参数资料
型号: HMC256
厂商: HITTITE MICROWAVE CORP
元件分类: 混频器
英文描述: 5900 MHz - 12000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 10.5 dB CONVERSION LOSS-MAX
封装: 1.60 X 1.30 MM, 0.10 MM HEIGHT, DIE-4
文件页数: 4/6页
文件大小: 157K
代理商: HMC256
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3 - 5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. BOND PADS ARE .004” SQUARE.
3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006”.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
Die Packaging Information [1]
Standard
Alternate
WP-3 (Waffle Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
HMC256
v03.1007
GaAs MMIC I/Q MIXER
5.9 - 12 GHz
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