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参数资料
| 型号： | HMC264LM3 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 混频器 |
| 英文描述： | 20000 MHz - 30000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| 封装： | PLASTIC, LM3, 6 PIN |
| 文件页数： | 10/10页 |
| 文件大小： | 379K |
| 代理商： | HMC264LM3 |
MICROWAVE CORPORATION
5 - 142
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Visit us at www.hittite.com, or Email at sales@hittite.com
MIXERS
-
SMT
5
GaAs MMIC SUB-HARMONIC
SMT MIXER, 20 - 30 GHz
v01.1201
HMC264LM3 Recommended SMT Attachment Technique
Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting
The HMC LM3 package was designed to be compatible with
high volume surface mount PCB assembly processes. The
LM3 package requires a specic mounting pattern to allow
proper mechanical attachment and to optimize electrical per-
formance at millimeterwave frequencies. This PCB layout pat-
tern can be found on each LM3 product data sheet. It can also
be provided as an electronic drawing upon request from Hittite
Sales & Application Engineering.
Follow these precautions to avoid permanent damage:
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM3 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to
the top of the lid.
Solder Materials & Temperature Prole: Follow the information contained in the application note. Hand soldering is not
recommended. Conductive epoxy attachment is not recommended.
Solder Paste
Solder paste should be selected based on the user’s experience and be compatible with the metallization systems
used. See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste
will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical
performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Reow
The soldering process is usually accomplished in a reow oven but may also use a vapor phase process. A solder
reow prole is suggested above.
Prior to reowing product, temperature proles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and vary-
ing component masses. The nal prole should be determined by mounting the thermocouple to the PCB at the location
of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reow prole. A standard prole
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and reow for the solvent in the paste to evaporate and the
ux to completely activate. Reow must then occur prior to the ux being completely driven off. The duration of peak
reow temperature should not exceed 15 seconds. Packages have been qualied to withstand a peak temperature of
235°C for 15 seconds. Verify that the prole will not expose device to temperatures in excess of 235°C.
Cleaning
A water-based ux wash may be used.
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TEMPERATURE
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0
C)
TIME (min)
HMC264LM3
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HMC264LM3_06 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 30 GHz |
| HMC264LM3_08 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 30 GHz |
| HMC264-SX | 功能描述:IC MIXER SUB-HARMONIC DIE 制造商:analog devices inc. 系列:- 包装:散装 零件状态:在售 RF 类型:通用 频率:20GHz ~ 32GHz 混频器数:1 增益:- 噪声系数:10dB 辅助属性:升/降频器 电流 - 电源:28mA 电压 - 电源:3 V ~ 4 V 封装/外壳:模具 供应商器件封装:模具 标准包装:2 |
| HMC265 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED DOWNCONVERTER, 20 - 32 GHz |
| HMC265_08 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC SUB-HARMONICALLY PUMPED DOWNCONVERTER, 20 - 32 GHz |
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