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参数资料
| 型号： | HMC311SC70 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 放大器 |
| 英文描述： | 0 MHz - 8000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | PLASTIC, SC-70, 6 PIN |
| 文件页数： | 4/6页 |
| 文件大小： | 233K |
| 代理商： | HMC311SC70 |
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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9 - 17
Outline Drawing
Absolute Maximum Ratings
Collector Bias Voltage (Vcc)
+7V
RF Input Power (RFIN)(Vcc = +3.9V)
+10 dBm
Junction Temperature
150 °C
Continuous Pdiss (T = 85 °C)
(derate 5.21 mW/°C above 85 °C)
0.34 W
Thermal Resistance
(junction to lead)
191 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
HMC311SC70
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
311
HMC311SC70E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
311
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
Package Information
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEAD MATERIAL: COPPER ALLOY
3. LEAD PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
HMC311SC70 / 311SC70E
v02.1108
InGaP HBT GAIN BLOCK
MMIC AMPLIFIER, DC - 8 GHz
相关PDF资料 |
PDF描述 |
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| HMC311ST89E | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| HMC313 | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| HMC313TR | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| HMC313ETR | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| HMC313E | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HMC311SC70_09 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 8 GHz |
| HMC311SC70E | 功能描述:IC GAIN BLOCK AMP SC70 RoHS:是 类别:RF/IF 和 RFID >> RF 放大器 系列:- 标准包装:3,000 系列:- 频率:100MHz ~ 6GHz P1dB:9.14dBm（8.2mW） 增益:15.7dB 噪音数据:1.3dB RF 型:CDMA，TDMA，PCS 电源电压:2.7 V ~ 5 V 电流 - 电源:60mA 测试频率:2GHz 封装/外壳:0505（1412 公制） 包装:带卷 (TR) |
| HMC311SC70ETR | 制造商:Hittite Microwave Corp 功能描述:IC GAIN BLOCK AMP SC70 制造商:Hittite Microwave Corp 功能描述:HMC311 Series DC - 8 GHz InGaP HBT Gain Block MMIC Amplifier - SC70-6 |
| HMC311ST89 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz |
| HMC311ST89_06 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6.0 GHz |
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