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参数资料
| 型号： | HMC363S8GE |
| 厂商： | Hittite Microwave Corporation |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | IC FREQ DIVIDER DC-12GHZ 8SOIC |
| 标准包装： | 1 |
| 功能： | 预定标器 |
| 频率： | 0Hz ~ 12GHz |
| RF 型： | 通用 |
| 次要属性： | 8 分型 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm Width）裸露焊盘 |
| 包装： | 标准包装 |
| 其它名称： | 1127-1028-6 |
HMC363S8G / 363S3GE
v05.0412
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 12 GHz
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB RF GROUND.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking [3]
HMC363S8G
HMC363S8GE
Low Stress Injection Molded Plastic
RoHS-compliant Low Stress Injection Molded Plastic
Sn/Pb Solder
100% matte Sn
MSL1
MSL1
[1]
[2]
HMC363
XXXX
HMC363
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
4
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HMC363S8GETR | 制造商:Hittite Microwave Corp 功能描述:IC FREQ DIVIDER DC-12GHZ 8SOIC 制造商:Hittite Microwave Corp 功能描述:HMC363 Series DC - 12 Ghz InGaP HBT Divide-by-8 SMT Divider - S8G |
| HMC363-SX | 功能描述:IC FREQ DIVID DC-10GHZ DIE 制造商:analog devices inc. 系列:- 包装:托盘 零件状态:在售 功能:除以 8 频率:0Hz ~ 12GHz RF 类型:VSAT，DBS 辅助属性:- 封装/外壳:模具 供应商器件封装:模具 标准包装:2 |
| HMC364 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs HBT MMIC DIVIDE-BY-2, DC - 13 GHz |
| HMC364_07 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs HBT MMIC DIVIDE-BY-2, DC - 13 GHz |
| HMC364_09 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs HBT MMIC DIVIDE-BY-2, DC - 13 GHz |
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