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参数资料
| 型号： | HMC365S8GE |
| 厂商： | Hittite Microwave Corporation |
| 文件页数： | 3/6页 |
| 文件大小： | 0K |
| 描述： | IC FREQ DIVIDER DC-13GHZ 8SOIC |
| 标准包装： | 1 |
| 功能： | 预定标器 |
| 频率： | 0Hz ~ 13GHz |
| RF 型： | 通用 |
| 次要属性： | 4 分型 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm Width）裸露焊盘 |
| 包装： | 标准包装 |
| 其它名称： | 1127-1029-6 |
HMC365S8G / 365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13 GHz
6
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
Absolute Maximum Ratings
700
500
300
100
-100
-300
-500
-700
RF Input (Vcc = +5V)
Vcc
Junction Temperature
Continuous Pdiss (T= 85°C)
(derate 15 mW/°C above 85°C)
Thermal Resistance (RTH)
(junction to ground paddle)
Storage Temperature
Operating Temperature
+13 dBm
+5.5V
135 °C
760 mW
65.8 °C/W
-65 to +150 °C
-40 to to +85 °C
22.7
23.1
23.5
23.9
24.3
24.7
TIME (nS)
Typical Supply Current vs. Vcc
Vcc (V)
4.75
Icc (mA)
94
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
5.0
5.25
110
118
Note: Divider will operate over full voltage range shown above
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB RF GROUND.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking [3]
HMC365S8G
HMC365S8GE
Low Stress Injection Molded Plastic
RoHS-compliant Low Stress Injection Molded Plastic
Sn/Pb Solder
100% matte Sn
MSL1
MSL1
[1]
[2]
HMC365
XXXX
HMC365
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
6 - 46
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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相关代理商/技术参数 |
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| HMC365S8GETR | 制造商:Hittite Microwave Corp 功能描述:IC FREQ DIVIDER DC-13GHZ 8SOIC 制造商:Hittite Microwave Corp 功能描述:HMC365 Series DC - 103GHz SMT GaAs HBT MMIC Divide-by-4 - SOIC-8EP |
| HMC365S8GTR | 功能描述:IC MMIC HBT DC-13GHZ 8SOIC 制造商:analog devices inc. 系列:- 包装:剪切带（CT） 零件状态:在售 功能:除以 4 频率:0Hz ~ 13GHz RF 类型:VSAT 辅助属性:- 封装/外壳:8-SOIC（0.154"，3.90mm 宽）裸露焊盘 供应商器件封装:8-SMT 标准包装:1 |
| HMC365-SX | 功能描述:IC FREQ DIVID DC-10GHZ DIE 制造商:analog devices inc. 系列:- 包装:托盘 零件状态:在售 功能:除以 4 频率:0Hz ~ 13GHz RF 类型:VSAT，DBS 辅助属性:- 封装/外壳:模具 供应商器件封装:模具 标准包装:2 |
| HMC368LP4 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:SMT GaAs PHEMT MMIC AMP-DOUBLER-AMP, 9.0 - 16.0 GHz OUTPUT |
| HMC368LP4_06 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:SMT GaAs PHEMT MMIC AMP-DOUBLER-AMP, 9.0 - 16.0 GHz OUTPUT |
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