参数资料
型号: HMC368LP4
厂商: HITTITE MICROWAVE CORP
元件分类: 倍频器
英文描述: 4500 MHz - 8000 MHz RF/MICROWAVE FREQUENCY DOUBLER
封装: 4 X 4 MM, MINIATURE, LEADLESS, PLASTIC, SMT, QFN-24
文件页数: 4/6页
文件大小: 263K
代理商: HMC368LP4
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
Typical Supply Current vs. Vdd
Vdd (V)
Idd (mA)
4.5
73
5.0
75
5.5
77
RF Input (Vdd = +5V)
+20 dBm
Supply Voltage, Vd1, Vd2
+6.0V
Gate Bias Voltage (Vg1, Vg2)
-4 to 0 Vdc
Channel Temperature
150 °C
Continuous Pdiss (T = 85 °C)
(derate 12.5 mW/°C above 85 °C)
812 mW
Thermal Resistance
(junction to ground paddle)
80 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Note: Amp-Doubler-Amp will operate over full voltage
range shown above.
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
SMT GaAs PHEMT MMIC
AMP-DOUBLER-AMP, 9 - 16 GHz OUTPUT
v03.0705
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC368LP4
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H368
XXXX
HMC368LP4E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
H368
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
HMC368LP4 / 368LP4E
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