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参数资料
| 型号： | HMC369LP3 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 倍频器 |
| 英文描述： | 9900 MHz - 12700 MHz RF/MICROWAVE FREQUENCY DOUBLER |
| 封装： | 3 X 3 MM, PLASTIC, SMT, 16 PIN |
| 文件页数： | 4/6页 |
| 文件大小： | 229K |
| 代理商： | HMC369LP3 |
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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4 - 43
Absolute Maximum Ratings
Outline Drawing
Typical Supply Current vs. Vcc
Vcc (V)
Icc (mA)
4.5
45
5.0
46
5.5
47
RF Input (Vcc = +5V)
+20 dBm
Vcc
+5.5V
Channel Temperature
135 °C
Continuous Pdiss (T=85 °C)
(derate 6.8 mW/°C above 85 °C)
440 mW
Thermal Resistance (R
th
)
(junction to ground paddle)
147.8 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Note: Multiplier will operate over full voltage range shown
above.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC369LP3
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
369
XXXX
HMC369LP3E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
369
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
SMT GaAs HBT MMIC x2 ACTIVE
FREQUENCY MULTIPLIER, 9.9 - 12.7 GHz OUTPUT
v04.0210
HMC369LP3 / 369LP3E
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HMC369LP3_07 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:SMT GaAs HBT MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 9.9 - 12.7 GHz OUTPUT |
| HMC369LP3_10 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:SMT GaAs HBT MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 9.9 - 12.7 GHz OUTPUT |
| HMC369LP3E | 制造商:Hittite Microwave Corp 功能描述:IC MULTIPLIER X2 ACTIVE 16-QFN |
| HMC36DRAH | 功能描述:CONN EDGECARD 72POS R/A .100 SLD RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:36 位置数:72 卡厚度:0.125"（3.18mm） 行数:2 间距:0.156"（3.96mm） 特点:- 安装类型:通孔，直角 端子:焊接 触点材料:铜铍 触点表面涂层:金 触点涂层厚度:30µin（0.76µm） 触点类型：:环形波纹管 颜色:绿 包装:托盘 法兰特点:- 材料 - 绝缘体:聚苯硫醚（PPS） 工作温度:-65°C ~ 150°C 读数:双 |
| HMC36DRAH-S734 | 功能描述:CONN EDGECARD 72POS .100 R/A PCB RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:18 位置数:36 卡厚度:0.062"（1.57mm） 行数:2 间距:0.156"（3.96mm） 特点:卡扩展器 安装类型:板边缘，跨骑式安装 端子:焊接孔眼 触点材料:亚稳态 触点表面涂层:金 触点涂层厚度:30µin（0.76µm） 触点类型：:全波纹管 颜色:绿 包装:托盘 法兰特点:顶部安装开口，浮动线轴，0.116"（2.95mm）直径 材料 - 绝缘体:聚苯硫醚（PPS） 工作温度:-65°C ~ 200°C 读数:单路 |
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