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参数资料
| 型号： | HMC416LP4E |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 放大器 |
| 英文描述： | 2750 MHz - 3000 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| 封装： | 4 X 4 MM, ROHS COMPLIANT, LEADLESS, PLASTIC, SMT, QFN-24 |
| 文件页数： | 3/6页 |
| 文件大小： | 214K |
| 代理商： | HMC416LP4E |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
Vcc
+3.5 Vdc
Vtune
0 to +11V
Channel Temperature
135 °C
Continuous Pdiss (T = 85°C)
(derate 3.6 mW/°C above 85°C)
180 mW
Thermal Resistance (R
TH
)
(junction to package base)
277 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Typical Supply Current vs. Vcc
Note: VCO will operate over full voltage range shown above.
Vcc (V)
Icc (mA)
2.75
32
3.0
37
3.25
42
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
MMIC VCO w/ BUFFER
AMPLIFIER, 2.75 - 3.0 GHz
v02.0805
HMC416LP4 / 416LP4E
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOT FOR SUGGESTED
LAND PATTERN.
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC416LP4
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H416
XXXX
HMC416LP4E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
H416
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
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