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参数资料
| 型号： | HMC496LP3E |
| 厂商： | 美国讯泰微波有限公司上海代表处 |
| 英文描述： | SiGe WIDEBAND DIRECT MODULATOR RFIC, 4.0 - 7.0 GHz |
| 中文描述： | 宽频带直接硅锗射频调制器，4.0 - 7.0吉赫 |
| 文件页数： | 6/10页 |
| 文件大小： | 487K |
| 代理商： | HMC496LP3E |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Vcc
-0.5 to +6.0V
LO Input Power
+10 dBm
Baseband Input Voltage
(Reference to GND)
-0.5 to +2.0V
Channel Temperature
150 °C
Continuous Pdiss (T = 85°C)
(Derate 110 mW/°C above 85°C)
7 Watts
Thermal Resistance (R
th
)
(junction to lead)
9 °C/Watt
Storage Temperature
-40 to +150 °C
Operating Temperature
-40 to +85 °C
Outline Drawing
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC496LP3
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
496
XXXX
HMC496LP3E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
496
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST
BE SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
PCB LAND PATTERN.
SiGe WIDEBAND DIRECT
MODULATOR RFIC, 4.0 - 7.0 GHz
v03.0206
HMC496LP3
/
496LP3E
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