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参数资料
| 型号： | HMC527 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 混频器 |
| 英文描述： | 8500 MHz - 13500 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 10 dB CONVERSION LOSS-MAX |
| 封装： | 1.49 X 1.14 MM, 0.10 MM HEIGHT, DIE-6 |
| 文件页数： | 4/6页 |
| 文件大小： | 222K |
| 代理商： | HMC527 |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Harmonics of LO
LO Freq. (GHz)
nLO Spur at RF Port
1234
8.5
43
48
50
77
9.5
48
47
57
64
10.5
53
51
62
53
11.5
50
57
67
45
12.5
48
52
67
47
13.5
44
51
64
xx
LO = +19 dBm
Values in dBc below input LO level measured at RF Port.
MxN Spurious Outputs
nLO
mRF
0
1234
0xx
-11
16
22
38
133053
62
95
286
77
76
78
94
396
95
101
91
102
489
94
96
101
107
RF = 10.6 GHz @ -10 dBm
LO = 10.5 GHz @ +19 dBm
Data taken without IF hybrid
All values in dBc below IF power level
Absolute Maximum Ratings
RF / IF Input
+20 dBm
LO Drive
+27 dBm
Channel Temperature
150°C
Continuous Pdiss (T=85°C)
(derate 7.1 mW/°C above 85°C)
460 mW
Thermal Resistance (R
TH
)
(junction to die bottom)
140 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 deg °C
Outline Drawing
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
Die Packaging Information [1]
Standard
Alternate
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC527
v01.1007
GaAs MMIC I/Q MIXER
8.5 - 13.5 GHz
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