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参数资料
| 型号： | HMC611 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 检测器 |
| 英文描述： | 1 MHz - 10000 MHz RF/MICROWAVE THRESHOLD DETECTOR, 15 dBm INPUT POWER-MAX |
| 封装： | 1.39 X 1.34 MM, 0.25 MM HEIGHT, ROHS COMPLIANT, DIE-30 |
| 文件页数： | 3/12页 |
| 文件大小： | 538K |
| 代理商： | HMC611 |
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For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
Mounting & Bonding Techniques for MMICs
the die should be attached directly to the ground plane with epoxy (see
HMc general Handling, Mounting , Bonding Note).
50 ohm Microstrip transmission lines on 0.254mm (10 mil) thick alumina
thin film substrates are recommended for bringing rF to and from the chip
(Figure 1).
Microstrip substrates should be placed as close to the die as possible in
order to minimize bond wire length. typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either waffle or Gel based esD protec-
tive containers, and then sealed in an esD protective bag for shipment.
once the sealed esD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. Do Not attempt to clean the chip using liquid cleaning sys-
tems.
Static Sensitivity: Follow esD precautions to protect against esD strikes.
Transients: suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias
cables to minimize inductive pick-up.
General Handling: the chip may be handled by a vacuum collet or with a sharp pair of tweezers.
Mounting
epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. cure epoxy per the manufacturer’s schedule.
0.254mm (0.010”) Thick MMIC
Wire Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
HMC611
v04.0209
60 dB, LOGARITHMIC
DETECTOR / CONTROLLER, 1 - 10000 MHz
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