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参数资料
| 型号： | HMC620 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 混频器 |
| 英文描述： | 3000 MHz - 7000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 9 dB CONVERSION LOSS-MAX |
| 封装： | 1.49 X 1.15 MM, 0.10 MM HEIGHT, DIE-6 |
| 文件页数： | 4/6页 |
| 文件大小： | 237K |
| 代理商： | HMC620 |
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Harmonics of LO
LO Freq. (GHz)
nLO Spur at RF Port
1234
2.5
29
35
48
30
326
33
51
39
428
32
39
43
528
36
45
52
636
44
60
41
740
36
58
34
846
37
55
46
LO = +15 dBm
Values in dBc below input LO level measured at RF Port.
MxN Spurious Outputs
nLO
mRF
0
1234
0xx1
15
28
69
1150
30
39
50
269
67
78
60
71
395
95
73
95
4
9595959595
RF = 5.6 GHz @ -10 dBm
LO = 5.5 GHz @ +15 dBm
Data taken without IF 90 hybrid
All values in dBc with reference to output power at IF= 100 MHz
Absolute Maximum Ratings
RF / IF Input
+20 dBm
LO Drive
+27 dBm
Channel Temperature
150 °C
Continuous Pdiss (T=85°C)
(derate 14.2 mW/°C above 85°C)
925 mW
Thermal Resistance (R
TH
)
(channel to die bottom)
70.2 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
Outline Drawing
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE ±.002”
Die Packaging Information [1]
Standard
Alternate
WP-3
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC620
v01.1007
GaAs MMIC I/Q MIXER
3 - 7 GHz
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相关代理商/技术参数 |
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