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参数资料
| 型号： | HMC866LC3C |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 放大器 |
| 英文描述： | RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | 3 X 3 MM, ROHS COMPLIANT, CERAMIC, LEADLESS, SMT, 16 PIN |
| 文件页数： | 6/10页 |
| 文件大小： | 1332K |
| 代理商： | HMC866LC3C |
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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6 - 5
HMC866LC3C
v01.0910
32 Gbps LIMITING AMPLIFIER
Power Supply Voltage (Vcc)
-0.5V to +3.6V
Input Voltage
(Vcc -1.3V) to
(Vcc +0.5)
Output Voltage
(Vcc -1V) to
(Vcc +0.5)
Output Amplitude Control Voltage (VAC)
-0.5V to +2.5V
Junction Temperature
125 °C
Continuous Pdiss (T = 85°C)
(Derate 12.22 mW/°C above 85°C)
0.49W
Thermal Resistance (Rth)
(junction to ground paddle)
81.83 °C/W
Storage Temperature
-65 to 125 °C
Operating Temperature
-40 to +85 °C
Absolute Maximum Ratings
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING:
30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-
6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
7. PADDLE MUST NOT BE DC GND. THERMAL DISSIPATION PATH ONLY.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
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相关代理商/技术参数 |
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| HMC866LC3C_09 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:32 Gbps LIMITING AMPLIFIER |
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| HMC869LC5_10 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:GaAs MMIC I/Q DOWNCONVERTER 12 - 16 GHz |
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