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参数资料
| 型号： | HMC976LP3E |
| 厂商： | Hittite Microwave Corporation |
| 文件页数： | 10/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 4.8V/ADJ .4A 16QFN |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式或可调式 |
| 输出电压： | 4.8V，1.8 V ~ 5.1 V |
| 输入电压： | 3.3 V ~ 5.5 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 400mA（最小值） |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘 |
| 供应商设备封装： | 16-QFN-EP（3x3） |
| 包装： | 标准包装 |
| 其它名称： | 1127-1080-6 |
HMC976LP3E
v02.1112
400mA LOW NOISE, HIGH PSRR
LINEAR VOLTAGE REGULATOR
Thermal dissipation should be taken into account at all times especially with large dropout voltages VDD-VR, i.e.
if 1.8V output is required from 5.5V input voltage, then the output current must be restricted to <210mA , or VDD
restricted to <3.75V for a 400mA load.
The exact maximum operating temperature before the thermal protection circuit activates is largely dependent on
the customer PCB design. Below is an example for maximum ambient temperature calculation for the standard
HMC976LP3E evaluation PCB with no heat sink and no air flow (fans). Customers should perform this calculation for
their PCB layout and operating conditions.
VIN=5.5V, Vout=5.0V, Iout=400mA
Vdropout=VIN-VOUT=0.5V
Dissipated power on regulator Pd=0.5Vx0.4A=0.2W
θ ja =51.5°C/W
Junction temperature increase using standard HMC976 board: DTj=Pd x θ ja =10.3°C. Thermal shutdown
junction temperature of regulator (absolute min) Tsdwn=+115°C. Maximum corresponding ambient temperature
Ta_max = Tsdwn - DTj = +104.7°C
The plots below show how the PCB ground copper area affects the HMC976LP3E junction temperature for different
HMC976LP3E power dissipation conditions. The following cases are included in the plots:
1 . 100 mm 2 Copper Area
2 . 1000 mm 2 Copper Area
3 . 2580 mm 2 Copper Area HMC976LP3E Evaluation PCB No Heat Sink (HS)
4 . 2580 mm 2 Copper Area HMC976LP3E Evaluation PCB with Heat Sink (HS)
5 . JEDEC Board as per JESD51-3
The typical corresponding θ ja is shown in Table 8:
Table 8. Typical
θ ja for specified PCB Copper Sizes
Copper size (mm 2 )
100
1000
2580 no HS
2580 with HS
θ ja ( ° C/W)
173.5
57.3
51.5
44
Figure 14. HMC976LP3E JUNCTION TEMPERATURE
°C vs. TOTAL POWER DISSIPATION 25°C AMBIENT
150
115°C WORST CASE
THERMAL SHUTDOWN
125
Tjmax
Figure 15. HMC976LP3E JUNCTION TEMPERATURE
°C vs. TOTAL POWER DISSIPATION 50°C AMBIENT
150
115°C WORST CASE
THERMAL SHUTDOWN
125
Tjmax
100mm no HS
100mm no HS
1000mm no HS
2580mm no HS
100
2
100
2
2
2
1000mm no HS
2580mm with HS
2
2
2580mm no HS
2580mm with HS
75
2
2
75
50
50
JEDEC no HS
25
0
0.1
0.2
0.3 0.4 0.5 0.6 0.7
JEDEC no HS
0.8 0.9
1
25
0
0.1
0.2
0.3 0.4 0.5 0.6 0.7
0.8
0.9
1
POWER DISSIPATION (W)
POWER DISSIPATION (W)
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
978-250-3343 tel ? 978-250-3373 fax ? Order On-line at www.hittite.com
Application Support: apps@hittite.com
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