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参数资料
| 型号： | HPJ3F |
| 厂商： | EMC TECHNOLOGY INC |
| 元件分类： | 耦合器 |
| 英文描述： | 1700 MHz - 2000 MHz RF/MICROWAVE 90 DEGREE HYBRID COUPLER, 0.2 dB INSERTION LOSS-MAX |
| 封装： | ROHS COMPLIANT, SURFACE MOUNT PACKAGE-4 |
| 文件页数： | 2/2页 |
| 文件大小： | 425K |
| 代理商： | HPJ3F |
LTCC QUADRATURE
HYBRID COUPLERS
D A T A S H E E T
HPJ3F
6.9.2010
2
emct.com rflabs.com 772-286-9300
AS 9100, ISO 9001, ISO 14001, OHSAS 18001 Certified
COUPLER PIN CONFIGURATION AND MECHANICAL OUTLINE
PORTS
P1
P2
P3
P4
P1
-
ISO
-90°
0°
P2
ISO
-
0°
-90°
P3
-90°
0°
-
ISO
P4
0°
-90°
ISO
-
0.250±0.006 [6.35±0.15]
0.200±0.006 [5.08±0.15]
0.075±0.004 [1.91±0.10]
0.043±0.003 [1.09±0.08]
0.024±0.003 [0.61±0.08]
0.114±0.003 [2.90±0.08]
0.164±0.003 [4.17±0.08]
P1
P2
P3
P4
P1
P2
P3
P4
GRND
COMMONLY USED ATTACHMENT MATERIALS
Material
Composition
Thermal Conductivity
( Watts/cm/°°°°C )
Melting Temperature
( °°°°C )
Gold-Tin Solder
80% Gold / 20% Tin
0.58
280
Lead-Free Solder
99.3% Tin – 0.7% Copper
N/A
227
Lead-Free Solder
96.5% Tin / 3.5% Silver
0.33
221
Lead-Free Solder
96.5% Tin / 3% Silver / 0.5% Copper
N/A
217 - 220
Sn63 Solder
63% Tin / 37% Lead
0.49
183
Conductive Epoxy
Silver Filled
0.01 to 0.29
N/A
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| HDF-TR | 960 MHz - 1220 MHz RF/MICROWAVE 90 DEGREE HYBRID COUPLER, 0.25 dB INSERTION LOSS-MAX |
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| HEA-TR | 150 MHz - 250 MHz RF/MICROWAVE 90 DEGREE HYBRID COUPLER, 0.25 dB INSERTION LOSS-MAX |
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