参数资料
型号: HRMP-W.FLJ
厂商: Hirose Electric Co Ltd
文件页数: 6/6页
文件大小: 0K
描述: RF CONN CONVERSION ADAPTER
标准包装: 1
系列: BWA
适配器类型: 插头至插孔
适配器系列: SMA 至 W.FL
中心类型: 母型至公型
转换源(适配器端): SMA 插头,公引脚
转换到(适配器端): W.FL 插孔,母插口
转换类型: 跨系列
样式: 直形
安装类型: 自由悬挂
其它名称: *HRMP-W.FLJ
Q1955519
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
W.FL have q Ultra Small willbe Mount soon.Pleasecheckthe productsstatuson     Hirosewebsite
All non-RoHS products Series been discontinued, or Surface discontinued Coaxial Connectors – 1.4mm the Mated Height RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
s Precautions
1. Plug
(1) Mating / unmating
? Unmating
Insert both ends of the extraction tool under the plug (from the direction opposite to the Cable
termination), as shown and pull-up in the direction perpendicular to the mounting surface of the
receptacle.
q Recomended the use of the extraction tool for unmating.
W.FL-LP-N plug extraction tool
Any attempt of unmating by pulling on the cable may result in
W.FL Cable
Assembly
damage and affect the mechanical / electrical performance.
(2) Pull forces on the
cable after connectors
are mated
? Mating
Do not attempt to insert on an extreme angle.
W.FL-LP-040
Cable Assembly
W.FL-R-SMT-1
After the connectors are mating, do not apply
a load to the cable in excess of the values
W.FL-R-SMT-1
Receptacle
2N max
indicated in the diagram.
(3) Precautions
2. Receptacle
(1) Recommended reflow
Do not twist connectors excessively during mating / unmating.
temperature profile
[?]
260
240
250 ? max. for
10 seconds
230?
220
200
180
160
140
120
100
80
Preheat
(130 to 180?)
120 seconds max.
220?
50 seconds max.
60 seconds max.
Time
q The temperature of the printed circuit board surface temperature at the points of contact with the terminals.
w Reflow soldering should be performed at a printed circuit surface temperature of 250°C max.
e In individual applications the actual temperature may vary, depending on the solder paste type, volume / thickness and
board size / thickness. Consuly your solder paste and equipment manufacturer for specific recommendations.
(2) Manual soldering
(3) Recommended metal
mask thickness
(4) Reflow cycles
Soldering iron temperature: 350°C, Soldering time: for 5 seconds max.
0.1 mm to 0.12 mm
2 times
3. Operating environment and storage conditions
(1) Operating environment
(2) Storage conditions -
Receptacle
The connectors are not designed to operate in the following environments:
? Exposed to a excessive amounts of fine particles and dust
? Regions and places having a high density of sulfur dioxide, hydrogen sulfide, nitrogen dioxide or other corrosive gasses.
? Environments having large rapid variations in temperature.
Store in the Hirose Electric packaging.
Temperature: -10 to +40?, Humidity: 85% max.
Use within 6 months of delivery.
Receptacles for which the storage period has elapsed must be tested for solderability to the PC board mounting surface.
?
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN
PHONE: 81-3-3491-5300, FAX: 81-3-3495-5230
http://www.hirose.com
http://www.hirose-connectors.com
6
The contents of this catalog are current as of date of 02/2009. Contents are subject to change without notice for the purpose of improvements.
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