参数资料
| 型号： | HS201DR-CC2425W3U |
| 厂商： | Crydom Co. |
| 文件页数： | 4/16页 |
| 文件大小： | 0K |
| 描述： | RELAY SSR SPST 35A W/HEATSINK ZC |
| 其它有关文件： | Declaration of Conformity |
| 标准包装： | 10 |
| 系列： | HS |
| 电路： | SPST-NO（1 Form A） |
| 输出类型： | AC，过零 |
| 负载电流： | 35A |
| 输入电压： | 4 ~ 32VDC |
| 电压 - 负载： | 24 ~ 280 V |
| 安装类型： | DIN 轨道 |
| 端接类型： | 螺丝端子 |
| 封装/外壳： | Hockey Puck with Heat Sink |
| 包装： | 散装 |
| 继电器类型： | 继电器 |
Heat Sink Selection
Why Heat Sinks are required for Reliable Solid
State Relay operation
Heat Sinks are required to insure the proper operation and long term
reliability of Solid State Relays because they provide a means to dissipate
the power that is normally developed internally in the SSR into the
A
B
C
D
The selected SSR with specified thermal impedance (R Θ ssr ), forward
voltage drop (V f ), and maximum allowed internal operating temperature
(T j ).
The thermal interface material placed between the SSR and the Heat
Sink and its specified thermal impedance (R Θ tp ).
The calculated minimum Heat Sink thermal impedance rating (R Θ hs )
required for proper SSR operation.
The operating environment’s max ambient air temperature in °C (T A ).
surrounding ambient air and maintain a safe operating temperature.
A
B
C
D
All SSRs in their conduction state create thermal energy in the output
semiconductor at the rate of approximately 1 to 1.5 watts per ampere of load
current for AC output SSRs, and 0.2 to 1.5 watts per ampere of load current
for DC output SSRs depending upon their design. This power dissipation
raises the Solid State Relay’s operating temperature above the surrounding
ambient.
Solid State Relays can operate reliably without heat sinks up to
T J
T B
T HS2
T HS1
A
B
C
D
Panel Mount SSR
Thermal Interface Material
Heat Sink
Ambient Air
approximately 5 amps of load current depending upon model, duty cycle
and ambient temperature. Free air ratings of traditional panel mount SSRs
may be as high as 8 to 10 amps, but this rating relies on the SSRs exposed
metal base plate acting as a heat sink, meaning that it must be exposed to
ambient air.
Heat Sinks are made of high thermal conductive material such as
aluminum. Not only is aluminum’s thermal conductivity high, its cost is
relatively low. Although other materials such as steel may provide a limited
measure of heat sinking, thermal conductivity of these materials are
relatively low compared to aluminum and therefore far less effective as a
Heat Sink . Coatings also tend to diminish the thermal dissipation
T A
R θSSR R θTP R θHS T A
Solid State Relay - Heat Sink Assembly Thermal Model
To determine the minimum Heat Sink rating (R Θ hs ) required for a particular
application, the SSRs internal power dissipation must first be calculated.
The power developed in the SSR will be the product of the actual load
current in amps times the SSRs specified on state voltage drop at that
current ( P d = I f x V f ). Note: Manufacturers generally specify 'maximum
forward voltage drop' in their data sheets. Typical voltage drops are often
much lower.
effectiveness of most materials and except anodizing, should be avoided.
For this example, assume that a 25 amp AC output SSR is selected to switch
Heat Sink performance is rated by thermal impedance, measured in °C per
watt (°C/W) (thermal impedance is the inverse of thermal conductivity).
Thermal impedance represents the resistance to the transfer of thermal
energy, therefore lower numerical thermal impedance ratings mean more
efficient heat transfer.
Thermal Impedance ratings of Heat Sinks are based upon natural
convection air flow. To achieve this performance, the Heat Sink must be
oriented such that air flow over its finned surface is maximized. Generally
an AC load current of 18 amps with forward voltage drop specified to be 1.25
volts. Therefore the power generated in the SSR is 18 amps times 1.25 volts
= 22.5 watts.
Next, determine the Solid State Relay’s specified thermal impedance and
allowed maximum internal temperature (if the max internal temperature is
not specified by the manufacturer, assume 125 °C as this is a common value
for many AC power semiconductors). For this example, assume R Θ ssr of 0.3
°C/W and T j of 125 °C.
this means the fins should be orientated vertically.
The next step is to determine the maximum operating ambient temperature
Significant improvement in Heat Sink performance can be achieved by
providing forced air flow over the Heat Sink’s surface area. Fans delivering
relatively small volumes of air can reduce the Heat Sink’s thermal
impedance substantially, thereby improving its efficiency and consequently
the SSRs reliability.
Selecting a Heat Sink for a given Solid State
Relay application
Crydom offers technical assistance selecting a heat sink for any given SSR
application through its Applications Engineering Department and on its web
site. Available “White Papers” and a selection “tool” to calculate a heat sink
rating based upon load current and ambient temperature are available at
www.crydom.com .
How to calculate and select a Heat Sink for a
given Solid State Relay application
The basic structure of a Solid State Relay includes an internal power
semiconductor mounted to an electrical insulator which in turn is mounted
to the Solid State Relay’s base plate. To form an assembly, the SSR with an
accompanying thermal interface material placed on its base plate is then
torque mounted to the Heat Sink .
The thermal model representing the above configuration includes the
following elements:
(T A ) in °C that the SSR will be expected to operate in its application. The
ambient value should be the ambient air temperature of the local
environment such as the interior of a control cabinet where the SSR and
Heat Sink are to be mounted. In this example, assume T A of 55 °C.
Finally, the thermal impedance of the interface material (R Θ tp ) must be
determined. These materials will vary from 0.02 to 0.1 °C per watt
depending upon the type and thickness selected. For this example, assume
that the thermal impedance of the selected interface material R Θ tp is 0.05
°C/W.
The first calculation is to determine the temperature span ( ? t) that the
SSRs power must be dissipated into in order to maintain its proper
operation. This will be the difference between the SSRs maximum allowed
internal temperature and the local ambient temperature. ? t = T j max – T A .
In this example the result would be: ? t = 125 – 55 = 70 °C.
The maximum allowed temperature rise noted above, ? t, must then be less
than or equal to the combined sum of temperature rises across the three
impedances times the power being developed in the SSR. ? t < (R Θ ssr + R Θ tp
+ R Θ hs ) times P d . For this example it would be 70 < (0.3 + 0.05 + R Θ hs ) x 22.5.
Therefore the Heat Sink thermal impedance is R Θ hs < ( ? t /P d ) – (R Θ ssr + R Θ tp )
or 70/22.5 – 0.35, equaling 2.76 °C/W.
Therefore in this example, a 2.75 °C/W or larger (lower numerical value)
Heat Sink should be used with the Solid State Relay in the application as
described above.
4
Questions? Call or e-mail
Americas +1 (877) 502 5500 sales@crydom.com
Europe +44 (0) 1202 606030 sales-europe@crydom.com
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