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参数资料
| 型号： | HSBF |
| 厂商： | EMC TECHNOLOGY INC |
| 元件分类： | 耦合器 |
| 英文描述： | 470 MHz - 860 MHz RF/MICROWAVE 90 DEGREE HYBRID COUPLER, 0.3 dB INSERTION LOSS-MAX |
| 封装： | 0.650 X 0.480 INCH, ROHS COMPLIANT PACKAGE-4 |
| 文件页数： | 4/10页 |
| 文件大小： | 1639K |
| 代理商： | HSBF |
Text
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Florida RF Labs 8851 SW Old Kansas Ave. Stuart, FL 34997
(772) 286-9300 (800) 544-5594 www.rflabs.com
61
General Specifications
HybriX 3dB Hybrid Couplers
Size
Insertion
Amplitude
Phase
Average
Model
Frequency
(LxW)
Isolation
Loss
VSWR
Balance
Power*
Number
GHz
Inches
dB Min
dB Max
Max:1
dB Max
deg Max
Watts/CW
.150 - .250
1.0 x 1.0
25
0.25
1.10
±0.10
2
200
HEA
.470 - .860
.650 x .480
20
0.30
1.29
±0.50
3
200
HSB
.700 - 1.0
.650 x .480
22
0.20
1.18
±0.20
3
250
HSC
.815 - .960
.560 x .350
22
0.20
1.20
±0.30
3
200
HDD
.815 - .960
.650 x .480
22
0.20
1.20
±0.30
3
200
HSD
.960 - 1.22
.560 x .350
18
0.25
1.25
±0.30
3
200
HDF
1.0 - 2.0
.560 x .350
20
0.24
1.25
±0.50
3
200
HDE
1.7 - 2.0
.560 x .200
24
0.14
1.15
±0.20
2
200
HMJ
1.7 - 2.0
.560 x .350
23
0.23
1.15
±0.30
3
200
HDJ
1.7 - 2.0
.650 x .480
23
0.20
1.18
±0.30
3
200
HSJ
1.8 - 2.7
.250 x .200
17
0.40
1.40
±0.45
5.5
100
HPJ
1.9 - 2.2
.500 x .250
20
0.25
1.20
±0.35
2
150
HTK
1.9 - 2.2
.560 x .350
20
0.25
1.20
±0.20
3
200
HDK
1.9 - 2.2
.650 x .480
18
0.30
1.29
±0.30
3
200
HSK
2.0 - 2.3
.560 x .200
24
0.14
1.15
±0.20
2
200
HML
2.0 - 2.5
.500 x .250
20
0.20
1.20
±0.35
2
150
HTM
2.0 - 4.0
.560 x .350
20
0.35
1.15
±0.50
3
200
HDS
2.3 - 2.7
.560 x .200
23
0.14
1.15
±0.20
2
200
HMP
2.7 - 3.2
.560 x .200
22
0.14
1.25
±0.35
3
200
HMQ
3.4 - 3.6
.560 x .200
22
0.14
1.20
±0.20
4
200
HMR
* at 85C
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