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参数资料
| 型号： | HSF8-20-15.00-DP |
| 厂商： | SAMTEC INC |
| 元件分类： | 连接器件 |
| 英文描述： | INTERCONNECTION DEVICE |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 1/4页 |
| 文件大小： | 567K |
| 代理商： | HSF8-20-15.00-DP |
DO NOT
SCALE FROM
THIS PRINT
SIGNAL
-SE: SINGLE ENDED
-DP: DIFFERNTIAL PAIR
(SEE FIG 2)
-05.00
-10.00
-15.00
LENGTH (IN INCHES)
-020, -030 (SEE FIG. 1)
-050 (SEE FIG. 2)
No OF POSITIONS
HSF8-0XX-XX.00-XX
* NOT RELEASED
*
SEE NOTE 4
(NO OF POS x .0315[.800] + .0492[1.25]
LENGTH (IN INCHES)
-XX.00
.040
(TYP)
1.03
'A'
SINGNAL
GROUND
PIN 1
(PIN 2 ON OPPOSITE SIDE)
PIN 2
(PIN 1 ON OPPOSITE SIDE
C2
.555 14.10
.062±.006 1.57±0.152
MEASURED OVER FINISH
.016 0.40
'B'
C3
.0217 0.55
.0315 0.80
DETAIL 'A'
SCALE 4 : 1
*
.012 0.30
45°±10°
DETAIL 'B'
SCALE 8 : 1
RIGID LAYER 1
.002[.05] ADHESIVE
.020[.05] FR4
.002[.05] SOLDERMASK
TOP SOLDERMASK
CROSS SECTION OF
FLEX & STIFFENER
NOT TO SCALE
FOR REFERENCE ONLY
TOP COVERFILM
.002[0.05] POLYIMIDE
.001[0.03] ADHESIVE
LAYER 2
COPPER CLAD
1/2 OZ COPPER
.002[.05] KAPTON
ADHESIVE
.001[0.03] ADHESIVE
LAYER 3/ 4
COPPER CLAD
1/2 OZ COPPER
.002[.05] KAPTON
1/2 OZ COPPER
BOTTOM COVERFILM
.001[0.03] ADHESIVE
.002[0.05] POLYIMIDE
RIGID LAYER 1
ADHESIVE
RIGID LAYER 5
ADHESIVE
.002[.05] ADHESIVE
RIGID LAYER 5
BOTTOM SOLDERMASK
.002[.05] SOLDERMASK
.020[.05] FR4
FIG. 1
HSF8-020-XX.00-SE SHOWN
C
C1
C4
C19
C20
*
C
SHEET OF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
ANGLES
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
FLEX CARD
BY:
HSF8-0XX-XX.00-XX
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
T. SPINE
11/2/2005
4
1
SHEET SCALE: 2:1
F:\DWG\MISC\Mktg\HSF8-0XX-XX.00-XX-MKT.SLDDRW
NOTES:
1.
REPRESENTS A CRITICAL DIMENSION.
2. ALL DIMENSIONS TO BE SYMMERTICAL ABOUT CENTERLINE
WITHIN .002[0.05] UNLESS OTHERWISE STATED.
3. PARTS TO BE LAYER PACKAGED.
4. SAMTEC LOGO, PART #, PANEL ID #, AND DATE CODE TO BE ETCHED
OR MARKED PERMANENTLY INTO FLEX.
5. IMPEDANCE TO BE 100 OHMS +/- 10% FOR -DP SIGNALS AND 50 OHMS +/-10% FOR -SE SIGNALS.
VENDOR MAY ADJUST TRACE WIDTHS FROM PROVIDED GERBER
TO MEET IMPEDANCE, VENDOR TO PROVIDE IMPEDANCE VERIFICATION REPORT.
6. SURFACE FINISH OF PADS TO BE .000030 HARD GOLD
OVER .000100 NICKEL MIN.
7. PARTS TO BE ELECTRICALLY TESTED FOR OPENS AND SHORTS
8. FABRICATION OF THIS PARTS SHALL BE IN CONFORMANCE WITH IPC 6013 CLASS 2
9. HOLE PLATING TO BE 0.00098 MINIMUM. HOLE DIAMETER SPECIFIED AFTER PLATING
10. NOTE DELETED.
11. CROSS SECTION DATA TO BE SUPPLIED BY VENDOR FOR PLATING AND TRACE REQUIREMENTS.
MATERIAL:
SEE CROSS SECTION DETAIL
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
REVISION C
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