参数资料
型号: HSMN-A400-S8PM2
元件分类: LED
英文描述: SINGLE COLOR LED, BLUE, 2.2 mm
封装: ROHS COMPLIANT, PLASTIC, SMT, LCC-4
文件页数: 3/11页
文件大小: 122K
代理商: HSMN-A400-S8PM2
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright 2005-2011 Avago Technologies. All rights reserved. Obsoletes AV01-0312EN
AV02-0479EN - July 28, 2011
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per
JEDEC J-STD-020. Precaution when handling this moisture
sensitive product is important to ensure the reliability of
the product. Refer to Avago Application Note AN 5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90% RH for 12 months. If the actual shelf life
has exceeded 12 months and the HIC indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
– It is not recommended to open the MBB prior to
assembly (e.g., for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60% RH at all
times and all high temperature related processes,
including soldering, curing or rework, need to be
completed within 672 hours.
C. Control of unfinished reel
– Unused LEDs need to be stored in sealed MBB with
desiccant or in desiccator at <5% RH.
D. Control of assembled boards
– If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
needs to be stored in sealed MBB with desiccant
or in desiccator at <5% RH to ensure no LEDs have
exceeded their floor life of 672 hours.
E. Baking is required if:
– “10%” is Not blue and “5%” HIC indicator turns pink.
– The LEDs are exposed to conditions of >30°C/60%
RH at any time.
– The LEDs' floor life exceeds 672 hours.
Recommended baking conditions: 60±5°C for 20 hours.
Handling Precautions
The encapsulation material of the InGaN family product
is made of silicone for better reliability of the product.
As silicone is a soft material, please do not press on the
silicone or poke a sharp object onto the silicone. These
might damage the product and cause premature failure.
During assembly or handling, the unit should be held on
the body only. Please refer to Avago Application Note AN
5288 for detail information.
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