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参数资料
| 型号： | HSMP-386A-BLK |
| 英文描述： | Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) |
| 中文描述： | PIN二极管表面贴装采用SOT - 323（的SC - 70 3引脚） |
| 文件页数： | 10/12页 |
| 文件大小： | 92K |
| 代理商： | HSMP-386A-BLK |
10
Assembly Information
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 27
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto-
mated assembly equipment
without adding parasitics that
could impair performance.
0.026
0.035
0.07
0.016
Figure 27. PCB Pad Layout
( dimensions in inches) .
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-323
package, will reach solder reflow
temperatures faster than those
with a greater mass.
HP’s SOT-323 diodes have been
qualified to the time-temperature
profile shown in Figure 28. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
MAX
) should not
exceed 235
°
C.
These parameters are typical for a
surface mount assembly process
for HP SOT-323 diodes. As a
general guideline, the circuit
board and components should be
exposed only to the minimum
temperatures and times necessary
to achieve a uniform reflow of
solder.
TIME (seconds)
T
MAX
T
°
C
0
0
50
100
150
200
250
60
Preheat
Zone
Cool Down
Zone
Reflow
Zone
120
180
240
300
Figure 28. Surface Mount Assembly Profile.
相关PDF资料 |
PDF描述 |
|---|---|
| HSMP-386A-TR1 | Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) |
| HSMP-389A-BLK | Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) |
| HSMP-389A-TR1 | Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) |
| HSMP-481B-BLK | Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) |
| HSMP-481B-TR1 | Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HSMP-386ASERIES | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Surface Mount PIN Diodes in SOT-323 (SC-70) (99K in pdf) |
| HSMP-386A-TR1 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) |
| HSMP-386B | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) |
| HSMP-386B-BLK | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead) |
| HSMP-386B-BLKG | 功能描述:PIN 二极管 50 VBR 0.2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel |
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