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参数资料
| 型号： | HSMP-386F-TR1 |
| 英文描述： | Surface Mount PIN Diodes |
| 中文描述： | 表面贴装PIN二极管 |
| 文件页数： | 2/9页 |
| 文件大小： | 143K |
| 代理商： | HSMP-386F-TR1 |
2
Package Lead Code
Identification, SOT-23
(Top View)
Package Lead Code
Identification, SOT-323
(Top View)
COMMON
CATHODE
#4
COMMON
ANODE
#3
SERIES
#2
SINGLE
#0
COMMON
CATHODE
F
COMMON
ANODE
E
SERIES
C
SINGLE
B
Package Lead Code
Identification, SOT-363
(Top View)
UNCONNECTED
TRIO
6
5
L
1
2
3
4
Electrical Specifications T
C
= 25
°
C, each diode
PIN General Purpose Diodes, Typical Specifications T
A
= 25
°
C
Package
Part Number
Marking
Lead
HSMP-
Code
Code
L0
[1]
0
3862
L2
[1]
2
3863
L3
[1]
3
3864
L4
[1]
4
386B
L0
[2]
B
386C
L2
[2]
C
386E
L3
[2]
E
386F
L4
[2]
F
386L
LL
[2]
L
Minimum
Breakdown
Voltage V
BR
(V)
50
Typical
Typical
Series Resistance Total Capacitance
R
S
(
)
3.0/1.5*
Configuration
C
T
(pF)
0.20
3860
Single
Series
Common Anode
Common Cathode
Single
Series
Common Anode
Common Cathode
Unconnected Trio
Test Conditions
V
R
= V
BR
Measure
I
R
≤
10
μ
A
I
F
= 10 mA
f = 100 MHz
I
F
= 100 mA*
V
R
= 50 V
f = 1 MHz
Notes:
1. Package marking code is laser marked.
Absolute Maximum Ratings
[1]
T
C
= +25
°
C
Symbol
Parameter
Forward Current (1
μ
s Pulse)
P
IV
Peak Inverse Voltage
T
j
Junction Temperature
T
stg
Storage Temperature
θ
jc
Thermal Resistance
[2]
Unit
SOT-23
SOT-323
I
f
Amp
V
°
C
°
C
°
C/W
1
50
150
1
50
150
-65 to 150
500
-65 to 150
150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to
the device.
2. T
C
= +25
°
C, where T
C
is defined to be the temperature at the package pins where
contact is made to the circuit board.
ESD WARNING:
Handling Precautions Should Be
Taken To Avoid Static Discharge.
相关PDF资料 |
PDF描述 |
|---|---|
| HSMP-386F-TR2 | Surface Mount PIN Diodes |
| HSMP-386L-BLK | Surface Mount PIN Diodes |
| HSMP-386L-TR1 | Surface Mount PIN Diodes |
| HSMP-386L-TR2 | Surface Mount PIN Diodes |
| HSMP-386X | Surface Mount PIN Diodes |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HSMP-386F-TR1G | 功能描述:PIN 二极管 50 VBR 0.2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel |
| HSMP-386F-TR2 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount PIN Diodes |
| HSMP-386F-TR2G | 功能描述:PIN 二极管 50 VBR 0.2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel |
| HSMP-386J-BLKG | 功能描述:PIN 二极管 50 VBR 0.2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel |
| HSMP-386J-TR1G | 功能描述:PIN 二极管 50 VBR 0.2 pF RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel |
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