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参数资料
| 型号： | HSMS-282F-TR1G |
| 英文描述： | Surface Mount RF Schottky Barrier Diodes |
| 中文描述： | 表面贴装射频肖特基二极管 |
| 文件页数： | 10/14页 |
| 文件大小： | 213K |
| 代理商： | HSMS-282F-TR1G |
10
Assembly Instructions
SOT-3x3 PCB Footprint
Recommended PCB pad layouts
for the miniature SOT-3x3 (SC-70)
packages are shown in Figures 26
and 27 (dimensions are in inches).
These layouts provide ample
allowance for package placement
by automated assembly equipment
without adding parasitics that
could impair the performance.
0.026
0.035
0.07
0.016
Figure 26. PCB Pad Layout, SOT-323
(dimensions in inches).
0.026
0.075
0.016
0.035
Figure 27. PCB Pad Layout, SOT-363
(dimensions in inches).
Figure 28. Surface Mount Assembly Profile.
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
packages, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent
’
s diodes have been
qualified to the time-temperature
profile shown in Figure 28. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
MAX
) should not
exceed 235
°
C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
TIME (seconds)
T
MAX
T
°
C
0
0
50
100
150
200
250
60
Preheat
Zone
Cool Down
Zone
Reflow
Zone
120
180
240
300
相关PDF资料 |
PDF描述 |
|---|---|
| HSMS-282F-TR2G | Surface Mount RF Schottky Barrier Diodes |
| HSMS-282K-BLKG | Surface Mount RF Schottky Barrier Diodes |
| HSMS-282K-TR1G | Surface Mount RF Schottky Barrier Diodes |
| HSMS-282K-TR2G | Surface Mount RF Schottky Barrier Diodes |
| HSMS-282L-BLKG | Surface Mount RF Schottky Barrier Diodes |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HSMS-282F-TR2 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount RF Schottky Barrier Diodes |
| HSMS-282F-TR2G | 功能描述:肖特基二极管与整流器 15 VBR 1 pF RoHS:否 制造商:Skyworks Solutions, Inc. 产品:Schottky Diodes 峰值反向电压:2 V 正向连续电流:50 mA 最大浪涌电流: 配置:Crossover Quad 恢复时间: 正向电压下降:370 mV 最大反向漏泄电流: 最大功率耗散:75 mW 工作温度范围:- 65 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SOT-143 封装:Reel |
| HSMS282K | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Surface Mount Zero Bias Schottky |
| HSMS-282K | 制造商:Avago Technologies 功能描述:DIODE SCHOTTKY RF SOT-363 |
| HSMS-282K-BLK | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount RF Schottky Barrier Diodes |
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