参数资料
型号: HSMX-C260
英文描述: Surface Mount Chip LEDs
中文描述: 表面贴装芯片LED
文件页数: 8/8页
文件大小: 217K
代理商: HSMX-C260
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface
Mounting SMT LED Indicator
Components.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
±
0.1 mm (
±
0.004 in.) unless otherwise specified.
Figure 11. Tape Leader and Trailer Dimensions.
END
START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Storage Condition: 5 to 30 C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5C for 20 hours.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/Interna-
tional), or 0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright 2002 Agilent Technologies, Inc.
Obsoletes 5988-0366EN
April 15, 2002
5988-6269EN
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HSMX-H670 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount Flip Chip LEDs