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参数资料
| 型号： | HSMX-C265 |
| 英文描述： | Agilent HSMx-C265 Surface Mount Chip LEDs |
| 中文描述： | 安捷伦HSMx - C265表面贴装发光二极管芯片 |
| 文件页数： | 7/8页 |
| 文件大小： | 209K |
| 代理商： | HSMX-C265 |
7
Figure 10. Tape dimensions.
Figure 11. Tape leader and trailer dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is 0.1 mm (0.004 in.) unless otherwise specified.
END
START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (0.004)
PART NUMBER
CATHODE
DIM. B
± 0.10 (0.004)
DIM. C
± 0.10 (0.004)
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface
Mounting SMT LED Indicator
Components
.
Storage Condition:
5 to 30
°
C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60
±
5
°
C for 20 hours.
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相关代理商/技术参数 |
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|---|---|
| HSMX-C650 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount Chip LEDs |
| HSMX-C660 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:Right Angle Surface Mount Chip LEDs |
| HSMX-C670 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount Chip LEDs |
| HSMX-H670 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount Flip Chip LEDs |
| HSMX-H690 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount Flip Chip LEDs |
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