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参数资料
| 型号： | HSMX-H670 |
| 英文描述： | Surface Mount Flip Chip LEDs |
| 中文描述： | 倒装芯片表面贴装发光二极管 |
| 文件页数： | 7/8页 |
| 文件大小： | 242K |
| 代理商： | HSMX-H670 |
Convective IR Reflow
Soldering
For information on IR reflow
soldering, refer to Application
Note 1060,
Surface Mounting
SMI LED Indicator
Components.
Figure 11. Tape Leader and Trailer Dimensions.
Figure 10. Tape Dimensions.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
1.30 ± 0.10
(0.051 ± 0.004)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
1.50 + 0.10
0
(0.059 + 0.004)
0
HSMX-H670 SERIES 2.40 (0.094) 1.60 (0.064)
HSMX-H690 SERIES 1.98 (0.078) 1.02 (0.040)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)
PART NUMBER
END
START
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 40 mm
(1.57 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
150 mm-360 mm
(5.9 - 14.2 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
相关PDF资料 |
PDF描述 |
|---|---|
| HSMX-H690 | Surface Mount Flip Chip LEDs |
| HSMY-C650 | Surface Mount Chip LEDs |
| HSMG-C650 | Surface Mount Chip LEDs |
| HSMG-C670 | Surface Mount Chip LEDs |
| HSMH-C650 | Surface Mount Chip LEDs |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HSMX-H690 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount Flip Chip LEDs |
| HSMX-S660 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:High Performance Surface Mount Chip LEDs |
| HSMX-S670 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:High Performance Surface Mount Chip LEDs |
| HSMX-S690 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:High Performance Surface Mount Chip LEDs |
| HSMY-A100 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:Surface Mount LED Indicator |
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