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参数资料
| 型号： | HSP43216VC-52Z |
| 厂商： | Intersil |
| 文件页数： | 11/20页 |
| 文件大小： | 0K |
| 描述： | IC HALFBAND FILTER 100-MQFP |
| 标准包装： | 66 |
| 滤波器类型： | 半带 |
| 滤波器数： | 4 |
| 电源电压： | 4.75 V ~ 5.25 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 100-BQFP |
| 供应商设备封装： | 100-MQFP（14x20） |
| 包装： | 托盘 |
19
FN3365.10
October 6, 2008
HSP43216
Plastic Leaded Chip Carrier Packages (PLCC)
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane
contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
-C-
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.045 (1.14)
R
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
CL
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
CL
N84.1.15 (JEDEC MS-018AF ISSUE A)
84 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
1.185
1.195
30.10
30.35
-
D1
1.150
1.158
29.21
29.41
3
D2
0.541
0.569
13.75
14.45
4, 5
E
1.185
1.195
30.10
30.35
-
E1
1.150
1.158
29.21
29.41
3
E2
0.541
0.569
13.75
14.45
4, 5
N84
84
6
Rev. 2 11/97
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相关代理商/技术参数 |
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| HSP43220 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Decimating Digital Filter |
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