参数资料
型号: HT86192(68PLCC)
英文描述: Microcontroller
中文描述: 微控制器
文件页数: 9/28页
文件大小: 195K
代理商: HT86192(68PLCC)
Pad Description
Pad Name
I/O
Mask Option
Description
PA0~PA7
I/O
Wake-up,
Pull-high
or None
Bidirectional 8-bit I/O port. Each bit can be configured as a wake-up input
by mask option. Software instructions determine the CMOS output or
Schmitt trigger input with or without pull-high resistor (mask option).
PB0~PB7
I/O
Pull-high
or None
Bidirectional 8-bit I/O port. Software instructions determine the CMOS
output or Schmitt trigger input (pull-high resistor depending on mask op-
tion).
PC0~PC7
I/O
Pull-high
or None
Bidirectional 8-bit I/O port. Software instructions determine the CMOS
output or Schmitt trigger input (pull-high resistor depending on mask op-
tion).
GND
Negative power supply, ground
VDD
Positive power supply
VCC
DAC power supply
VSS
DAC negative power supply, ground
RES
I
Schmitt trigger reset input, active low
INT
I
Falling Edge Trigger
or Falling/Rising Edge
Trigger
External interrupt Schmitt trigger input with pull-high resistor. Choice fall-
ing edge trigger or falling/rising edge trigger by mask option. Falling edge
triggered active on a high to low transition. Rising edge triggered active
on a low to high transition.
OSC1, OSC2
RC or Crystal
OSC1 and OSC2 are connected to an RC network or a crystal(by mask
option) for the internal system clock. In the case of RC operation, OSC2
is the output terminal for 1/4 system clock.
The system clock may come from the crystal, the two pins cannot be
floating.
AUD0, AUD1
O
Audio output for driving a external transistor or for driving HT82V733
NC
No connection
Absolute Maximum Ratings
Supply Voltage ..........................................2.4V to 5.2V
Storage Temperature ........................... 50 C to 125 C
Input Voltage .............................V
SS
0
.
3V to V
DD
+0.3V
Operating Temperature .......................... 20 C to 70 C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
HT86XXX
Rev. 1.00
9
November 1, 2002
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