参数资料
型号: HUF75545S3ST
厂商: Fairchild Semiconductor
文件页数: 1/10页
文件大小: 0K
描述: MOSFET N-CH 80V 75A D2PAK
产品培训模块: High Voltage Switches for Power Processing
标准包装: 1
系列: UltraFET™
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 80V
电流 - 连续漏极(Id) @ 25° C: 75A
开态Rds(最大)@ Id, Vgs @ 25° C: 10 毫欧 @ 75A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 235nC @ 20V
输入电容 (Ciss) @ Vds: 3750pF @ 25V
功率 - 最大: 270W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D²PAK
包装: 标准包装
产品目录页面: 1606 (CN2011-ZH PDF)
其它名称: HUF75545S3STDKR
HUF75545P3, HUF75545S3S
Data Sheet
N-Channel UltraFET Power MOSFET
80 V, 75 A, 10 m?
Packaging
Features
October 20 13
JEDEC TO-220AB
SOURCE
DRAIN
JEDEC TO-263AB
DRAIN
(FLANGE)
? Ultra Low On-Resistance
- r DS(ON) = 0.010 ?, V GS = 10V
DRAIN
(FLANGE)
GATE
GATE
SOURCE
? Simulation Models
- Temperature Compensated PSPICE? and SABER?
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
HUF75545P3
Symbol
D
HUF75545S3S T
? Peak Current vs Pulse Width Curve
? UIS Rating Curve
Ordering Information
PART NUMBER
HUF75545P3
PACKAGE
TO-220AB
BRAND
75545P
G
HUF75545S3ST
TO- 263AB
75545S
S
Absolute Maximum Ratings
T C = 25 o C, Unless Otherwise Specified
HUF75545P3,
HUF75545S3S T
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V DSS
Drain to Gate Voltage (R GS = 20k ? ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V GS
Drain Current
Continuous (T C = 25 o C, V GS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I D
Continuous (T C = 100 o C, V GS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P D
Derate Above 25 o C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T J , T STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T L
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T pkg
80
80
± 20
75
73
Figure 4
Figure 6
270
1.8
-55 to 175
300
260
V
V
V
A
A
W
W/ o C
o C
o C
o C
NOTES:
1. T J = 25 o C to 150 o C.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html
For severe environments, see our Automotive HUFA series.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
?2002 Fairchild Semiconductor Corporation
HUF75545P3 / HUF75545S3S Rev. C 1
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