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参数资料
| 型号： | HUM-70U1 |
| 英文描述： | Analog IC |
| 中文描述： | 模拟IC |
| 文件页数： | 9/13页 |
| 文件大小： | 338K |
| 代理商： | HUM-70U1 |
B8-22
CASE J
C
ASES
Materials
Header Case J1
Cold Rolled Steel/Nickel/Gold
Cases J2 - J5
Cold Rolled Steel/Nickel/Tin
Case J1
Kovar/Nickel
Case J2 - J5
Cold Rolled Steel/Nickel/Tin
#52 alloy (all cases)
Case J1
MHV Series Triple – compression glass seal
MTR Series Triple – ceramic seal
Cases J2 - J5
compression glass seal
Cover
Pins
Case dimensions in inches (mm)
Tolerance
±
0.005 (0.13) for three decimal places
±
0.01 (0.2) for two decimal places
unless otherwise specified
CASE J
BOTTOM VIEW
See Figures 36 - 40
for pin configuration
1.350 max
(34.29)
CAUTION
Heat from reflow or wave soldering may damage
the device. Solder pins individually with heat
application not exceeding 300
°
C for 10 seconds
per pin.
Flange Thickness:
Cases J1 and J5
Case J2
Cases J3 and J4
0.060 (1.52)
0.073 (1.85) max
0.067 +0.005/-0.007 (1.70 +0.13/-0.8)
2.720 max
(69.09)
Dot on top of case indicates pin one
F
IGURE
35: C
ASE
J M
AXIMUM
D
IMENSIONS
Note: Although every effort has been made to render the case drawings at actual size, variations in the printing process may cause some distortion. Please refer
to the numerical dimensions for accuracy.
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