参数资料
| 型号： | HVF2512T7504FE |
| 厂商： | Ohmite |
| 文件页数： | 1/1页 |
| 文件大小： | 0K |
| 描述： | RES 7.5M OHM 1W 1% 2512 |
| 产品培训模块： | High Voltage Resistors |
| 产品目录绘图： | High Volt Flip Chip Temperature Chart |
| 标准包装： | 100 |
| 系列： | HVF |
| 电阻（欧姆）： | 7.5M |
| 功率（瓦特）： | 1W |
| 复合体： | 厚膜 |
| 温度系数： | ±100ppm/°C |
| 容差： | ±1% |
| 封装/外壳： | 2512（6432 公制） |
| 尺寸/尺寸： | 0.252" L x 0.126" W（6.40mm x 3.20mm） |
| 高度： | 0.032"（0.81mm） |
| 端子数： | 2 |
| 包装： | 散装 |
| 产品目录页面： | 2262 (CN2011-ZH PDF) |
| 其它名称： | HVF2512T7504FEBK |
High Voltage
A
OHMITE’S HIGH VOLTAGE FLIP CHIP SERIES INCORPORATES HIGH ACCU -
RACY SCREEN PRINTING TECHNOLOGY TO ACHIEVE HIGH VOLTAGE CAPABILITY
IN A STABLE FLIP CHIP SMD CHIP RESISTOR PACKAGE. THE HVF SERIES
OFFERS UNMATCHED PERFORMANCE IN COMPARISON TO STANDARD CHIP
RESISTORS. ITS UNIQUE DESIGN PROVIDES LOWER VOLTAGE AND TEMPERA -
TURE COEFFICIENTS, LESS NOISE, TIGHTER TOLERANCES, BETTER STABILITY,
HIGHER RESISTANCE VALUES, AND HIGHER VOLTAGE RATINGS. HVF IS
AVAILABLE IN CONVENIENT 1206 AND 2512 FOOTPRINTS.
FEATURES SPECIFICATIONS
T
SILICONE
HVF Series
ALUMINUM OXIDE
Flip Chip Film
W
70 °
10M ..100M Ω
100M ..1G Ω
1G Ω .. 5G Ω
30M ..300M Ω
300M ..3G Ω
3G Ω .. 5G Ω
Tape
0.079 ± .002
2.0 ± 0.05
? HIGH VOLTAGE UP TO 3,000 VOLTS
? INDUSTRY STANDARD SIZES
? WORKING TEMPERATURE RANGE
–55°C TO 200°C
? DESIGNED FOR AUTOMATIC INSERTION
? NON-MAGNETIC CONSTRUCTION
DERATING
100
80
60
40
20
0
0 50 100 150 200
Ambient Temperature, ° C
V O LTA G E C O E F F I C I E N T
O F R E S I S TA N C E
Resistance VCR
Series Range (-ppm/V)*
1206 1K ..10M Ω <3.20
<15.00
<29.00
<40.00
2512 1K ..30M Ω <0.80
<4.00
<7.00
<10.00
*TYPICAL VALUES. VOLTAGE COEFFICIENT OF
RESISTANCE STRONGLY DEPENDS ON THE
RESISTANCE VALUE. CONTACT OHMITE FOR
DETAILS.
S TA N D A R D PA RT
NUMBERS FOR HVF
Ohms HVF1206--- HVF2512---
Resistance Range:
1K Ω TO 100G Ω
Resistance Tolerance: ±1% STD.;
5% FOR HVF1206 100M Ω -10G Ω
MORE; 10% FOR 10G Ω+
Temperature Coefficient:
±100PPM STD.
Coating: SILICONE
Solder Pad Material: SILVER
(PDAG)
Note : HVF Series should not be
used with tin-lead based solder
compositions. Only silver-based
solder compositions are recom-
mended. Care should be taken
in the selection of the solder flux
contained in the solder paste.
Some pastes are "corrosive" and
can damage the coating and
also the resistive layer during the
soldering process at high tem-
perature. PCBs must be properly
cleaned to remove any layers of
moisture containing halides below
the resistor.
We recommend Halide Free
(or Halogen Free) solder pastes,
containing for example ROL0 or
similar.
It is advisable for the PCB
layout to provide a slot, or air
gap, underneath the downward
facing resistor element, thereby
increasing insulation resistance
and reducing the possibility of
capacitive coupling to the PCB.
Under no circumstances should
any copper trace be present in the
layout directly under the resistive
element.
L
RUTHENIUM OXIDE SILVER (PDAG)
Power Std.
Resistance Rating Voltage Dimensions (in. ±0.008) Qty./
Series Range Tol. (mW) Rating* L W a T (max.) Reel**
HVF1206 1K-100M 1% std. 300 1,500 0.128 0.063 0.018 0.028 1000
100M-10G 5%
10G-100G 10%
HVF2512 1K-100G 1% std. 1000 3,000 0.252 0.126 0.026 0.032 1000
*Use Ohm’s Law (V= √ P*R) to calculate maximum working voltage.
**Maximum available quantity per reel is 3,500 for 1206 size and 2,000 for
2512 size; call 1-866-9-OHMITE for details.
P E R F O R M A N C E D ATA
INSULATION RESISTANCE >10,000 M Ω 500 VOLT 25 °C 75% RELATIVE HUMIDITY
DIELECTRIC STRENGTH >1,000 VOLT 25 °C 75% RELATIVE HUMIDITY
THERMAL SHOCK ? R/R < 0.1% TYP., MIL STD. 202, METHOD 107
0.50% MAX. COND. C (IEC 68 -2 -14)
OVERLOAD ? R/R < 0.1% TYP., 1,5 X PNOM, 5 SEC
0.50% MAX. (DO NOT EXCEED MAX. VOLTAGE)
MOISTURE RESISTANCE ? R/R < 0.1% TYP., MIL STD. 202,
0.50% MAX. METHOD 106 (IEC 68 -2 -3)
LOAD LIFE ? R/R < 0.1% TYP., 1000 HOURS AT RATED POWER
0.50% MAX. (IEC 115 -1)
TA P E A N D R E E L S P E C I F I C AT I O N S
Per EIA Std. RS-481
0.157 ± .004
0.059 + .004/-0.0 4.0 ± 0.10 0.032 ± .004
0.069 ± .004 1.5 + 0.10/-0.0 0.81 ± 0.10
1.75 ± 0.10
0.315 ± .012
B 8.0 ± 0.30
25K
50K
75K
100K
250K
500K
1000K
1500K
2000K
2500K
5000K
---T2502FE
---T5002FE
---T7502FE
---T1003FE
---T2503FE
---T5003FE
---T1004FE
---T1504FE
---T2004FE
---T2504FE
---T5004FE
---T2502FE
---T5002FE
---T7502FE
---T1003FE
---T2503FE
---T5003FE
---T1004FE
---T1504FE
---T2004FE
---T2504FE
---T5004FE
L A N D PAT T E R N ( i n . )
LAND PATTERN DIMENSIONS ARE FOR
REFERENCE ONLY
M
N L
O
0.138 ± .002
3.5 ± 0.05
0.157 ± .004
4.0 ± 0.10 A
DIRECTION OF FEED
7500K
---T7504FE
---T7504FE
1G
10G
---T1007JE
---T1008JE
---T1007FE
---T5007FE
Size
HVF1206
HVF2512
M
0.150
0.288
N
0.040
0.062
O
0.080
0.140
L
0.070
0.164
Trailer
230MM MIN.–560MM
MAX. MAY CONSIST OF
CARRIER AND/OR COVER TAPE
Components
Leader
MINIMUM OF 40
EMPTY COMPONENT
POCKETS SEALED
FOLLOWED BY A MINIMUM
WITH COVER TAPE
O R D E R I N G I N F O R M AT I O N
OF 160MM OF CARRIER WITH
SEALED COVER TAPE
Taping Code
RoHS BLANK = BULK PACKAGE
Compliant T = TAPE & REEL
HVF1206T1004JET
Reel
0.512 ± .008
13.0 ± .20
0.56 MAX.
14.2 max.
High Voltage Case Size TCR Ohms
Flip Chip 1206 T = 100 PPM FIRST 3 DIGITS ARE
Series 2512 V = 50 PPM* SIGNIFICANT; LAST
*Not available for all resistance NUMBER OF ZEROS TO
values; consult factory FOLLOW. EXAMPLE:
DIGIT SPECIFIES
1006 = 100M ?
Tolerance
F = 1%
G = 2%
J = 5%
7.00 ± .079
178.0 ± 2.0
1.969 MIN.
50.0 min.
0.331 +.059/-0.0
8.4 +1.5/-0.0
1-866-9-OHMITE ? INT’L 1-847-258-0300 ? FAX 1-847-574-7522 ? WWW.OHMITE.COM ? INFO@OHMITE.COM
Ohmite Mfg. Co.
3
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