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参数资料
型号： IBM25EMPPC740LEBB4000
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255
封装： 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件页数： 23/50页
文件大小： 600K
代理商： IBM25EMPPC740LEBB4000
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page iii
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Table of Contents
Preface ..................................................................................................................................................... 1
Overview ................................................................................................................................................... 1
Features ................................................................................................................................................... 3
General Parameters ................................................................................................................................. 6
Electrical and Thermal Characteristics ..................................................................................................... 7
DC Electrical Characteristics ................................................................................................................ 7
AC Electrical Characteristics .................................................................................................................. 11
Clock AC Specifications ...................................................................................................................... 11
60x Bus Input AC Specifications ......................................................................................................... 12
60x Bus Output AC Specifications ...................................................................................................... 14
L2 Clock AC Specifications ................................................................................................................. 16
L2 Bus Input AC Specifications ........................................................................................................... 18
L2 Bus Output AC Specifications ........................................................................................................ 19
IEEE 1149.1 AC Timing Specifications .................................................................................................. 20
PowerPC 740 Microprocessor Pin Assignments .................................................................................... 22
PowerPC 740 Microprocessor Pinout Listings ....................................................................................... 23
PowerPC 740 Package .......................................................................................................................... 26
Mechanical Dimensions of the 255 CBGA Package ........................................................................... 27
PowerPC 750 Microprocessor Pin Assignments .................................................................................... 28
PowerPC 750 Package .......................................................................................................................... 32
Mechanical Dimensions of the 360 CBGA Package ........................................................................... 33
System Design Information .................................................................................................................... 35
PLL Configuration ............................................................................................................................... 35
PLL Power Supply Filtering ................................................................................................................. 36
Decoupling Recommendations ........................................................................................................... 36
Connection Recommendations ........................................................................................................... 36
Output Buffer DC Impedance .............................................................................................................. 37
Pull-up Resistor Requirements ........................................................................................................... 38
Thermal Management Information ...................................................................................................... 39
Internal Package Conduction Resistance ........................................................................................... 40
Heat Sink Selection Example .............................................................................................................. 43
Ordering Information ............................................................................................................................... 45
相关PDF资料
PDF描述
IBM25EMPPC740LEBF3000 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
IBM25EMPPC750LDBA3660 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
IBM25EMPPC750LDBC3330 32-BIT, 333 MHz, RISC PROCESSOR, CBGA360
IBM25EMPPC750LDBE3330 32-BIT, 333 MHz, RISC PROCESSOR, CBGA360
IBM25EMPPC750EBUB2330 32-BIT, 233 MHz, RISC PROCESSOR, CBGA360
相关代理商/技术参数
参数描述
IBM25EMPPC740LEBB466 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBC300 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBC333 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBC366 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor
IBM25EMPPC740LEBC400 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor
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