参数资料
型号: IBM25EMPPC740LFBC4000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 400 MHz, RISC PROCESSOR, CBGA255
封装: 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件页数: 31/50页
文件大小: 600K
代理商: IBM25EMPPC740LFBC4000
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page 33
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Mechanical Dimensions of the 360 CBGA Package
Figure 16 provides the mechanical dimensions and bottom surface nomenclature of the 360 CBGA package.
Figure 16. Mechanical Dimensions and Bottom Surface Nomenclature of the 360 CBGA Package
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2.
DIMENSIONS IN MILLIMETERS.
3.
TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING FROM
THE ARRAY.
MILLIMETERS
DIM
Minimum
Maximum
A
2.65
3.20
A1
0.80
1.00
A2
1.10
1.30
b
0.82
0.93
D
25.00 BSC
D1
5.443
D2
2.48
D3
6.3
e
1.27 BSC
E
25.00 BSC
E1
8.075
E2
2.48
E3
7.43
e
19 18 17 16 15 14 13 12 11 10 9
8
7
6
5
4 3 2
1
U
V
W
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
B
C
360X
A
0.3
C
0.15
b
A
A1
A2
C
0.15 C
Not To Scale
(18x)
0.2
D
2X
E
E1
D1
0.2
2X
B
A
A01 Corner Locator
A01 Corner
CHIP
D2
D3
D2
D3
E3
E2
E3
E2
CAPACITOR
Note: All caps on the SCM are lower in height than the processor die.
Top View
There is no ball in the A01 position
A01 Corner
X-ray view of balls
from top of package
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