参数资料
型号: IBM25EMPPC750LFBE3000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 6/50页
文件大小: 600K
代理商: IBM25EMPPC750LFBE3000
Page 10
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Power Consumption for 740 and 750
Processor CPU Frequency
Unit
Notes
300
333
366
400
466
Full-On Mode
Typical
3.7
4.0
4.3
4.6
5.5
W
1, 3, 4, 5
Maximum
4.8
5.3
5.8
6.1
6.8
W
1,2,4,5
Doze Mode
Maximum
1.7
1.8
1.9
2.1
W
1,2,5
Nap Mode
Maximum
250
mW
1, 5
Sleep Mode
Maximum
TBD
mW
1, 5
Note:
1. These values apply for all valid 60x bus and L2 bus ratios. The values do not include I/O Supply Power (OVDD and L2OVDD) or PLL/DLL supply power
(AVDD and L2AVDD). OVDD and L2OVDD power is system dependent, but is typically <10% of VDD power. Worst case power consumption for AVDD =
15mW and L2AVDD = 15mW.
2. Maximum power is measured in a system executing worst case benchmark sequences at:
VDD = AVDD = L2VDD = 2.1V;
OVDD = L2OVDD = 3.3V;
Tj = 105 °C (300, 333, 366 MHz);
85
°C (400 MHz);
65
°C (466 MHz).
3. Typical power is an average value measured in a system executing typical applications and benchmark sequences at:
VDD = AVDD = L2AVDD = 2.0V (300, 333, 366, 400 MHz);
VDD = AVDD = L2AVDD = 2.05V (466 MHz);
OVDD = L2OVDD = 3.3V;
Tj = 45 °C.
4. Power dissipation is reduced approximately.1W per 10 degree C reduction in Tj.
5. Guaranteed by design and characterization, and is not tested.
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