参数资料
型号: IBM25NPE405H-3DA266C
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA580
封装: 35 MM, PLASTIC, EBGA-580
文件页数: 41/64页
文件大小: 1050K
代理商: IBM25NPE405H-3DA266C
Advance Information
PowerNPTM NPe405H Embedded Processor Data Sheet
46
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.
c. TCMax = TJMax – P
×θ
JC, where TJMax is maximum junction temperature and P is power consumption.
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device.
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
VDD
0 to 2.7
V
Supply Voltage (I/O Interface)
OVDD
0 to 3.6
V
PLL Supply Voltage
AVDD
0 to 2.7
V
Input Voltage (3.3V LVTTL receivers)
VIN
0 to 3.6
V
Input Voltage (5.0V LVTTL receivers)
VIN
0 to 5.5
V
Storage Temperature Range
TSTG
-55 to 150
°C
Case temperature under bias
TC
-40 to +120
°C
Package Thermal Specications
The NPe405H is designed to operate within a case temperature range of -40C to 120C. Thermal resistance values for
the E-PBGA packages in a convection environment are as follows:
Package—Thermal Resistance
Symbol
Airow
ft/min (m/sec)
Unit
0 (0)
100 (0.51)
200 (1.02)
35mm, 580-balls—Junction-to-Case
θ
JC
°C/W
35mm, 580-balls—Case-to-Ambient1
θ
CA
°C/W
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