参数资料
型号: IBM25PPC750CXEFP10-3T
元件分类: 微控制器/微处理器
英文描述: RISC PROCESSOR, PBGA256
封装: 27 X 27 MM, PLASTIC, BGA-256
文件页数: 15/42页
文件大小: 492K
代理商: IBM25PPC750CXEFP10-3T
PowerPC 750CXe RISC Microprocessor Datasheet
Page 22
Version 1.0
February, 2001
Figure 10 provides the test access port timing diagram.
6.0 PowerPC 750CX Microprocessor Dimension and Physical
Signal Assignments
IBM offers a plastic ball grid array, PBGA, which supports 256 balls as the PowerPC 750CXe package.
The following sections contain several views of the package, pin information, and a pin listing.
Figure 11 shows the pinout of the 256 PBGA package as viewed from the solder ball surface. Figure 12 shows the side
prole of the 256 PBGA package including the height from the top of the copper heat spreader to the bottom of the sol-
der balls. Figure 13 provides a more detailed side prole including the encapsulant (glob) referenced.
Figure 10. Test Access Port Timing Diagram
12
10
11
TCK
TDI, TMS
TDO
Input Data (Valid)
Output Data (Valid)
TDO
13
14
Output Data (Invalid)
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