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| 型号： | IBM25PPC750FX-GB0123T |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 |
| 封装： | 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 |
| 文件页数： | 4/62页 |
| 文件大小： | 452K |
| 代理商： | IBM25PPC750FX-GB0123T |
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DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
3. Electrical and Thermal Characteristics
Page 10 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
Note: All electrical specifications (AC, DC, timing) are guaranteed only while the device is operated within
the recommended operating conditions (see Table 3-2). Operation at other application conditions may also
be possible; see the PowerPC 750FX RISC Microprocessor Datasheet Supplement for details.
Table 3-2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Notes
Core supply voltage (full-on mode)
VDD
1.4 to 1.5
V
1, 2
Low Voltage (Low Frequency Operation, 1.8V and 2.5V
bus modes only)
VDD
1.2 Minimum
V
1
PLL supply voltage
AVDD
1.4 to 1.5
V
2
60x bus supply voltage (1.8V)
OVDD
1.7 to 1.9
V
2
60x bus supply voltage (2.5V)
OVDD
2.375 to 2.625
V
2
60x bus supply voltage (3.3V)
OVDD
3.135 to 3.465
V
Input voltage
VIN
GND to OVDD
V2
Die-junction temperature DD2.0 and 2.1
TJ
0 to 105
°C
Die-junction temperature DD2.2 and 2.3
TJ
-40 to 105
Notes:
1. In some cases, when using 1.8v or 2.5v IO mode, it is possible to reduce power dissipation by lowering the core power supply volt-
age. See the Datasheet Supplement for details.
2. These are tested operating conditions.
Table 3-3. Package Thermal Characteristics1
Characteristic
Symbol2
Value
Unit
CBGA package thermal resistance, junction-to-case thermal resistance (typical)
θ
JC
0.06
°C/W
CBGA package thermal resistance, junction-to-lead thermal resistance (typical)
θ
JB
7.6
°C/W
Notes:
1. A heat sink is required (see Section 5.8 Thermal Management on page 49).
2.
θ
JC
is the internal resistance from the junction to the back of the die. For more information about thermal management, see
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相关代理商/技术参数 |
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| IBM25PPC750FX-GB0132T | 制造商:IC'S/TRANSISTORS/DIO 功能描述: 制造商:IC'S/TRANSISTORS/DIODES 功能描述: |
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