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参数资料
| 型号： | ICL3227EIAZA |
| 厂商： | Intersil |
| 文件页数： | 9/20页 |
| 文件大小： | 0K |
| 描述： | IC TXRX SGL RS232 3-5.5V 16SSOP |
| 标准包装： | 77 |
| 类型： | 收发器 |
| 驱动器/接收器数： | 1/1 |
| 规程： | RS232 |
| 电源电压： | 3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 16-SSOP |
| 包装： | 管件 |
| 产品目录页面： | 1240 (CN2011-ZH PDF) |
17
FN4900.9
February 27, 2006
ICL3225E, ICL3227E, ICL3245E
Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
α
0.25
0.010
GAUGE
PLANE
A2
M16.209 (JEDEC MO-150-AC ISSUE B)
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.233
0.255
5.90
6.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N16
16
7
α
0°
8°
0°
8°
-
Rev. 3 6/05
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