参数资料
型号: ICL3232ECV-20T
厂商: Intersil
文件页数: 16/33页
文件大小: 0K
描述: IC 2DRVR/2RCVR RS232 3V 20-TSSOP
标准包装: 2,500
类型: 收发器
驱动器/接收器数: 2/2
规程: RS232
电源电压: 3 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 20-TSSOP
包装: 带卷 (TR)
23
FN4910.21
February 22, 2010
ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M
-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS
-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3
may have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
CL
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C A
M
BS
E18.3 (JEDEC MS-001-BC ISSUE D)
18 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.845
0.880
21.47
22.35
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N18
18
9
Rev. 2 11/03
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