参数资料
型号: ICL3243ECBZ-T
厂商: Intersil
文件页数: 24/33页
文件大小: 0K
描述: IC 3DRVR/5RCVR RS232 3V 28-SOIC
标准包装: 1,000
类型: 收发器
驱动器/接收器数: 3/5
规程: RS232
电源电压: 3 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.295",7.50mm 宽)
供应商设备封装: 28-SOIC W
包装: 带卷 (TR)
30
FN4910.21
February 22, 2010
ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
α
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
L
0.25
0.010
GAUGE
PLANE
A2
M20.209 (JEDEC MO-150-AE ISSUE B)
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.068
0.078
1.73
1.99
A1
0.002
0.008’
0.05
0.21
A2
0.066
0.070’
1.68
1.78
B
0.010’
0.015
0.25
0.38
9
C
0.004
0.008
0.09
0.20’
D
0.278
0.289
7.07
7.33
3
E
0.205
0.212
5.20’
5.38
4
e
0.026 BSC
0.65 BSC
H
0.301
0.311
7.65
7.90’
L
0.025
0.037
0.63
0.95
6
N20
20
7
α
0 deg.
8 deg.
0 deg.
8 deg.
Rev. 3 11/02
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