参数资料
| 型号： | ICM7555IPA |
| 厂商： | Intersil |
| 文件页数： | 12/12页 |
| 文件大小： | 0K |
| 描述： | IC OSC MONO TIMING 1MHZ 8-DIP |
| 标准包装： | 50 |
| 类型： | 555 型，计时器/振荡器（单路） |
| 频率： | 1MHz |
| 电源电压： | 2 V ~ 18 V |
| 电流 - 电源： | 60µA |
| 工作温度： | -25°C ~ 85°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 包装： | 管件 |
| 供应商设备封装： | 8-PDIP |
| 安装类型： | 通孔 |
| 其它名称： | 7555IPZ ICM7555IPZ ICMHA7555IPA NT5012 |
9
FN2867.9
August 24, 2006
ICM7555, ICM7556
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N8
8
7
α
0°
8°
0°
8°
-
Rev. 1 6/05
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