参数资料
型号: ICS275PG
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟产生/分配
英文描述: 200 MHz, OTHER CLOCK GENERATOR, PDSO16
封装: 0.173 INCH, TSSOP-16
文件页数: 3/9页
文件大小: 197K
代理商: ICS275PG
ICS275
TRIPLE PLL FIELD PROGRAMMABLE VCXO CLOCK SYNTHESIZER
EPROM VCXO AND SYNTHESIZER
IDT / ICS TRIPLE PLL FIELD PROGRAMMABLE VCXO CLOCK SYNTHESIZER 3
ICS275
REV C 061206
External Components
The ICS275 requires a minimum number of external
components for proper operation.
Series Termination Resistor
Clock output traces over one inch should use series
termination. To series terminate a 50
trace (a commonly
used trace impedance), place a 33
resistor in series with
the clock line, as close to the clock output pin as possible.
The nominal impedance of the clock output is 20
.
Decoupling Capacitors
As with any high-performance mixed-signal IC, the ICS275
must be isolated from system power supply noise to perform
optimally.
Decoupling capacitors of 0.01F must be connected
between each VDD and the PCB ground plane. For optimum
device performance, the decoupling capacitor should be
mounted on the component side of the PCB. Aboid the use
of vias on the decoupling circuit.
Quartz Crystal
The ICS275 VCXO function consists of the external crystal
and the integrated VCXO oscillator circuit. To assure the
best system performance (frequency pull range) and
reliability, a crystal device with the recommended
parameters (shown below) must be used, and the layout
guidelines discussed in the following section shown must be
followed.
The frequency of oscillation of a quartz crystal is determined
by its “cut” and by the load capacitors connected to it. The
ICS275 incorporates on-chip variable load capacitors that
“pull” (change) the frequency of the crystal. The crystal
specified for use with the ICS275 is designed to have zero
frequency error when the total of on-chip + stray
capacitance is 14 pF.
Recommended Crystal Parameters:
Initial Accuracy at 25°C
±20 ppm
Temperature Stability
±30 ppm
Aging
±20 ppm
Load Capacitance
14 pf
Shunt Capacitance, C0
7 pF Max
C0/C1 Ratio
250 Max
Equivalent Series Resistance
35
Max
The external crystal must be connected as close to the chip
as possible and should be on the same side of the PCB as
the ICS275. There should be no via’s between the crystal
pins and the X1 and X2 device pins. There should be no
signal traces underneath or close to the crystal. See
application note MAN05.
Crystal Tuning Load Capacitors
The crystal traces should include pads for small fixed
capacitors, one between X1 and ground, and another
between X2 and ground. Stuffing of these capacitors on the
PCB is optional. The need for these capacitors is
determined at system prototype evaluation, and is
influenced by the particular crystal used (manufacture and
frequency) and by PCB layout. The typical required
capacitor value is 1 to 4 pF.
To determine the need for and value of the crystal
adjustment capacitors, you will need a PC board of your final
layout, a frequency counter capable of about 1 ppm
resolution and accuracy, two power supplies, and some
samples of the crystals which you plan to use in production,
along with measured initial accuracy for each crystal at the
specified crystal load capacitance, CL.
To determine the value of the crystal capacitors:
1. Connect VDD of the ICS275 to 3.3 V. Connect pin 1 of the
ICS275 to the second power supply. Adjust the voltage on
pin 1 to 0V. Measure and record the frequency of the CLK
output.
2. Adjust the voltage on pin 1 to 3.3 V. Measure and record
the frequency of the same output.
To calculate the centering error:
Where:
ftarget = nominal crystal frequency
Error
10
6
x
f
3.0V
f
tet
arg
() f
0V
f
tet
arg
()
+
f
tet
arg
-----------------------------------------------------------------------
error
xtal
=
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